Yida LI

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Formation method of interconnection structure of semiconductor device
- Patent number 10,658,234
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal liner overhang reduction and manufacturing method thereof
- Patent number 9,899,258
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMI...
- Publication number 20180033687
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu HUNG
- H01 - BASIC ELECTRIC ELEMENTS