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Yie-Chuan Chiu
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Hsinchu City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Pyramid bump structure
Patent number
8,692,390
Issue date
Apr 8, 2014
Chipbond Technology Corporation
Chih-Hung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumping process and structure thereof
Patent number
8,658,528
Issue date
Feb 25, 2014
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for forming an anti-oxidant metal layer on an electronic de...
Patent number
8,450,049
Issue date
May 28, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bumping process and structure thereof
Patent number
8,415,243
Issue date
Apr 9, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
Publication number
20130193570
Publication date
Aug 1, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
Publication number
20130196498
Publication date
Aug 1, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
Publication number
20130181346
Publication date
Jul 18, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS
Publication number
20130183823
Publication date
Jul 18, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PYRAMID BUMP STRUCTURE
Publication number
20120211257
Publication date
Aug 23, 2012
Chih-Hung Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DE...
Publication number
20120208129
Publication date
Aug 16, 2012
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS