Yie-Chuan Chiu

Person

  • Hsinchu City, TW

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BUMPING PROCESS AND STRUCTURE THEREOF

    • Publication number 20130193570
    • Publication date Aug 1, 2013
    • Chipbond Technology Corporation
    • Chih-Ming Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMPING PROCESS AND STRUCTURE THEREOF

    • Publication number 20130196498
    • Publication date Aug 1, 2013
    • Chipbond Technology Corporation
    • Chih-Ming Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMPING PROCESS AND STRUCTURE THEREOF

    • Publication number 20130181346
    • Publication date Jul 18, 2013
    • Chipbond Technology Corporation
    • Chih-Ming Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMPING PROCESS

    • Publication number 20130183823
    • Publication date Jul 18, 2013
    • Chipbond Technology Corporation
    • Chih-Ming Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PYRAMID BUMP STRUCTURE

    • Publication number 20120211257
    • Publication date Aug 23, 2012
    • Chih-Hung Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DE...

    • Publication number 20120208129
    • Publication date Aug 16, 2012
    • Chih-Ming Kuo
    • H01 - BASIC ELECTRIC ELEMENTS