Yifei DOU

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Patents Grantslast 30 patents

Information Patent Grant
Leaf spring for an integrated circuit heat sink
- Patent number 12,129,901
- Issue date Oct 29, 2024
- NVIDIA Corporation
- Shenglei Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
LEAF SPRING FOR AN INTEGRATED CIRCUIT HEAT SINK
- Publication number 20250146551
- Publication date May 8, 2025
- NVIDIA Corporation
- Shengli WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAF SPRING FOR AN INTEGRATED CIRCUIT HEAT SINK
- Publication number 20240019009
- Publication date Jan 18, 2024
- NVIDIA Corporation
- Shenglei WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR