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YIH-HSING WANG
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TAOYUAN CITY, TW
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Patents Grants
last 30 patents
Information
Patent Grant
High-temperature gas pressure measuring method
Patent number
9,983,080
Issue date
May 29, 2018
NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Yih-Hsing Wang
G01 - MEASURING TESTING
Information
Patent Grant
Compensating chemical mechanical wafer polishing apparatus and method
Patent number
6,685,543
Issue date
Feb 3, 2004
Chung Shan Institute of Science & Technology
Jer-Shyong Lai
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS FOR PERFORMING SELENIZATION AND SULFURIZATION PROCESS ON...
Publication number
20180127875
Publication date
May 10, 2018
NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
WEN-CHUEH PAN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
HIGH-TEMPERATURE GAS PRESSURE MEASURING METHOD
Publication number
20170153160
Publication date
Jun 1, 2017
YIH-HSING WANG
G01 - MEASURING TESTING
Information
Patent Application
SELENIZATION/SULFURIZATION PROCESS APPARATUS FOR USE WITH SINGLE-PI...
Publication number
20170155005
Publication date
Jun 1, 2017
WEN-CHUEH PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of polishing semiconductor copper interconnect integrated wi...
Publication number
20040259481
Publication date
Dec 23, 2004
CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
Wen-Chueh Pan
B24 - GRINDING POLISHING
Information
Patent Application
Compensating chemical mechanical wafer polishing apparatus and method
Publication number
20030100196
Publication date
May 29, 2003
CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
Jer-Shyong Lai
B24 - GRINDING POLISHING