Yih Wang

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual gate control for trench shaped thin film transistors
- Patent number 12,191,395
- Issue date Jan 7, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench via for three-dimensional integrated circuit
- Patent number 12,100,705
- Issue date Sep 24, 2024
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having differentiated interconnect li...
- Patent number 12,080,643
- Issue date Sep 3, 2024
- Intel Corporation
- Travis W. Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors with spacer controlled gate length
- Patent number 11,997,847
- Issue date May 28, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed thin-channel thin-film transistor
- Patent number 11,978,804
- Issue date May 7, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical multi-gate thin film transistors
- Patent number 11,862,729
- Issue date Jan 2, 2024
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual gate control for trench shaped thin film transistors
- Patent number 11,862,728
- Issue date Jan 2, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical architecture of thin film transistors
- Patent number 11,843,054
- Issue date Dec 12, 2023
- Intel Corporation
- Van H. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,758,711
- Issue date Sep 12, 2023
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement metal COB integration process for embedded DRAM
- Patent number 11,723,188
- Issue date Aug 8, 2023
- Intel Corporation
- Uygar Avci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned bitline and capacitor via formation
- Patent number 11,690,215
- Issue date Jun 27, 2023
- Intel Corporation
- Abhishek A. Sharma
Information Patent Grant
4F2 DRAM cell using vertical thin film transistor
- Patent number 11,653,487
- Issue date May 16, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene-based approaches for embedding spin hall MTJ devices into...
- Patent number 11,469,268
- Issue date Oct 11, 2022
- Intel Corporation
- Kevin J. Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin-film transistor structures with gas spacer
- Patent number 11,404,536
- Issue date Aug 2, 2022
- Intel Corporation
- Travis W. LaJoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Approaches for embedding spin hall MTJ devices into a logic process...
- Patent number 11,393,873
- Issue date Jul 19, 2022
- Intel Corporation
- Kevin J. Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Deep trench via for three-dimensional integrated circuit
- Patent number 11,373,999
- Issue date Jun 28, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor embedded dynamic random-access memory with sha...
- Patent number 11,329,047
- Issue date May 10, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric-capacitor integration using novel multi-metal-level i...
- Patent number 11,322,504
- Issue date May 3, 2022
- Intel Corporation
- Uygar Avci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors with spacer controlled gate length
- Patent number 11,296,087
- Issue date Apr 5, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical thin film transistors having self-aligned contacts
- Patent number 11,296,229
- Issue date Apr 5, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory in three-dimensional integrated circuit
- Patent number 11,270,998
- Issue date Mar 8, 2022
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical multi-gate thin film transistors
- Patent number 11,245,038
- Issue date Feb 8, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of high density cross-point memory and CMOS logic for h...
- Patent number 11,233,040
- Issue date Jan 25, 2022
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory employing self-aligned top-gated thin film transistors
- Patent number 11,222,895
- Issue date Jan 11, 2022
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual gate control for trench shaped thin film transistors
- Patent number 11,183,594
- Issue date Nov 23, 2021
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed thin-channel thin-film transistor
- Patent number 11,171,240
- Issue date Nov 9, 2021
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 11,121,073
- Issue date Sep 14, 2021
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM with hierarchical bit lines in monolithic 3D integrated chips
- Patent number 11,114,446
- Issue date Sep 7, 2021
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip manufacturing process for integrating logic circ...
- Patent number 11,094,358
- Issue date Aug 17, 2021
- Intel Corporation
- Ilya Karpov
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS
- Publication number 20240055531
- Publication date Feb 15, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER
- Publication number 20220320275
- Publication date Oct 6, 2022
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20220285342
- Publication date Sep 8, 2022
- Intel Corporation
- Yih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...
- Publication number 20220208770
- Publication date Jun 30, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTORS WITH SPACER CONTROLLED GATE LENGTH
- Publication number 20220157820
- Publication date May 19, 2022
- Intel Corporation
- ABHISHEK A. SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MULTI-GATE THIN FILM TRANSISTORS
- Publication number 20220149208
- Publication date May 12, 2022
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MEMORY EMPLOYING SELF-ALIGNED TOP-GATED THIN FILM TRANSISTORS
- Publication number 20220122983
- Publication date Apr 21, 2022
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Application
DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS
- Publication number 20220028861
- Publication date Jan 27, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED THIN-CHANNEL THIN-FILM TRANSISTOR
- Publication number 20220029025
- Publication date Jan 27, 2022
- Intel Corporation
- Abhishek A. SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR
- Publication number 20210366821
- Publication date Nov 25, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS
- Publication number 20210125992
- Publication date Apr 29, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...
- Publication number 20210098373
- Publication date Apr 1, 2021
- Intel Corporation
- Travis W. LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF HIGH DENSITY CROSS-POINT MEMORY AND CMOS LOGIC FOR H...
- Publication number 20200357782
- Publication date Nov 12, 2020
- Intel Corporation
- Elijah V. KARPOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED THIN-CHANNEL THIN-FILM TRANSISTOR
- Publication number 20200279953
- Publication date Sep 3, 2020
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC CHIP INCLUDING EMBEDDED MAGNETIC TUNNEL JUNCTIONS
- Publication number 20200227472
- Publication date Jul 16, 2020
- Intel Corporation
- Kevin J. LEE
- G11 - INFORMATION STORAGE
Information Patent Application
THIN FILM TRANSISTORS WITH SPACER CONTROLLED GATE LENGTH
- Publication number 20200152635
- Publication date May 14, 2020
- Intel Corporation
- ABHISHEK A. SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY MEMORY ARCHITECTURE USING BACK SIDE METAL LAYERS
- Publication number 20200043980
- Publication date Feb 6, 2020
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL MULTI-GATE THIN FILM TRANSISTORS
- Publication number 20200044095
- Publication date Feb 6, 2020
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR LOW POWER WRITE AND READ OPERATIONS FOR RESISTIVE MEMORY
- Publication number 20200020378
- Publication date Jan 16, 2020
- Intel Corporation
- Liqiong WEI
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL THIN FILM TRANSISTORS HAVING SELF-ALIGNED CONTACTS
- Publication number 20200006572
- Publication date Jan 2, 2020
- Abhishek A. SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT METAL COB INTEGRATION PROCESS FOR EMBEDDED DRAM
- Publication number 20200006346
- Publication date Jan 2, 2020
- Uygar AVCI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC-CAPACITOR INTEGRATION USING NOVEL MULTI-METAL-LEVEL I...
- Publication number 20200006352
- Publication date Jan 2, 2020
- Uygar AVCI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
4F2 DRAM CELL USING VERTICAL THIN FILM TRANSISTOR
- Publication number 20190393222
- Publication date Dec 26, 2019
- Intel Corporation
- Abhishek SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SHARED GATE THIN-FILM TRANSISTOR-BASED CHARGE STORAGE MEMORY
- Publication number 20190393223
- Publication date Dec 26, 2019
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL ARCHITECTURE OF THIN FILM TRANSISTORS
- Publication number 20190393356
- Publication date Dec 26, 2019
- Intel Corporation
- Van H. LE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MEMORY EMPLOYING SELF-ALIGNED TOP-GATED THIN FILM TRANSISTORS
- Publication number 20190393224
- Publication date Dec 26, 2019
- Intel Corporation
- Yih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS OXIDE SEMICONDUCTOR MEMORY DEVICES
- Publication number 20190385949
- Publication date Dec 19, 2019
- Intel Corporation
- Van H. Le
- G11 - INFORMATION STORAGE
Information Patent Application
MONOLITHIC INTEGRATED CIRCUITS WITH MULTIPLE TYPES OF EMBEDDED NON-...
- Publication number 20190386062
- Publication date Dec 19, 2019
- Intel Corporation
- Yih WANG
- G11 - INFORMATION STORAGE
Information Patent Application
DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20190378836
- Publication date Dec 12, 2019
- Intel Corporation
- Yih WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY
- Publication number 20190326299
- Publication date Oct 24, 2019
- Intel Corporation
- YIH WANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Dual gate control for trench shaped thin film transistors

Through plate interconnect for a vertical MIM capacitor

Deep trench via for three-dimensional integrated circuit

Integrated circuit structures having differentiated interconnect li...

Thin film transistors with spacer controlled gate length

Recessed thin-channel thin-film transistor

Vertical multi-gate thin film transistors

Dual gate control for trench shaped thin film transistors

Vertical architecture of thin film transistors

Thin-film transistor embedded dynamic random-access memory with sha...

Replacement metal COB integration process for embedded DRAM

Self-aligned bitline and capacitor via formation

4F2 DRAM cell using vertical thin film transistor

Damascene-based approaches for embedding spin hall MTJ devices into...

Thin-film transistor structures with gas spacer

Approaches for embedding spin hall MTJ devices into a logic process...

Deep trench via for three-dimensional integrated circuit

Thin-film transistor embedded dynamic random-access memory with sha...

Ferroelectric-capacitor integration using novel multi-metal-level i...

Thin film transistors with spacer controlled gate length

Vertical thin film transistors having self-aligned contacts

Embedded memory in three-dimensional integrated circuit

Vertical multi-gate thin film transistors

Integration of high density cross-point memory and CMOS logic for h...

Embedded memory employing self-aligned top-gated thin film transistors

Dual gate control for trench shaped thin film transistors

Recessed thin-channel thin-film transistor

Through plate interconnect for a vertical MIM capacitor

SRAM with hierarchical bit lines in monolithic 3D integrated chips

Semiconductor chip manufacturing process for integrating logic circ...

Patents Applicationslast 30 patents

DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS

THIN-FILM TRANSISTOR STRUCTURES WITH GAS SPACER

DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT

THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY WITH SHA...

THIN FILM TRANSISTORS WITH SPACER CONTROLLED GATE LENGTH

VERTICAL MULTI-GATE THIN FILM TRANSISTORS

EMBEDDED MEMORY EMPLOYING SELF-ALIGNED TOP-GATED THIN FILM TRANSISTORS

DUAL GATE CONTROL FOR TRENCH SHAPED THIN FILM TRANSISTORS

RECESSED THIN-CHANNEL THIN-FILM TRANSISTOR

THROUGH PLATE INTERCONNECT FOR A VERTICAL MIM CAPACITOR

INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LI...

INTEGRATION OF HIGH DENSITY CROSS-POINT MEMORY AND CMOS LOGIC FOR H...

RECESSED THIN-CHANNEL THIN-FILM TRANSISTOR

LOGIC CHIP INCLUDING EMBEDDED MAGNETIC TUNNEL JUNCTIONS

THIN FILM TRANSISTORS WITH SPACER CONTROLLED GATE LENGTH

HIGH DENSITY MEMORY ARCHITECTURE USING BACK SIDE METAL LAYERS

VERTICAL MULTI-GATE THIN FILM TRANSISTORS

APPARATUS FOR LOW POWER WRITE AND READ OPERATIONS FOR RESISTIVE MEMORY

VERTICAL THIN FILM TRANSISTORS HAVING SELF-ALIGNED CONTACTS

REPLACEMENT METAL COB INTEGRATION PROCESS FOR EMBEDDED DRAM

FERROELECTRIC-CAPACITOR INTEGRATION USING NOVEL MULTI-METAL-LEVEL I...

4F2 DRAM CELL USING VERTICAL THIN FILM TRANSISTOR

VERTICAL SHARED GATE THIN-FILM TRANSISTOR-BASED CHARGE STORAGE MEMORY

VERTICAL ARCHITECTURE OF THIN FILM TRANSISTORS

EMBEDDED MEMORY EMPLOYING SELF-ALIGNED TOP-GATED THIN FILM TRANSISTORS

AMORPHOUS OXIDE SEMICONDUCTOR MEMORY DEVICES

MONOLITHIC INTEGRATED CIRCUITS WITH MULTIPLE TYPES OF EMBEDDED NON-...

DEEP TRENCH VIA FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT

THIN-FILM TRANSISTOR EMBEDDED DYNAMIC RANDOM-ACCESS MEMORY