Yihao Chen

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HAVING AN INCREASED METAL TRACE THICKNESS
- Publication number 20240332156
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rui Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Optimized Underfill Flow
- Publication number 20230299034
- Publication date Sep 21, 2023
- Western Digital Technologies, Inc.
- Yihao Chen
- H01 - BASIC ELECTRIC ELEMENTS