Yiheng XU

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical gate all-around transistor
- Patent number 10,950,722
- Issue date Mar 16, 2021
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin reveal forming STI regions having convex shape between fins
- Patent number 10,832,965
- Issue date Nov 10, 2020
- GLOBALFOUNDRIES Inc.
- Yiheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structures
- Patent number 10,790,198
- Issue date Sep 29, 2020
- GLOBALFOUNDRIES Inc.
- Fuad H. Al-Amoody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overturned thin film device with self-aligned gate and source/drain...
- Patent number 10,700,214
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced interconnect with air gap
- Patent number 10,546,743
- Issue date Jan 28, 2020
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 10,388,639
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate oxide formation through hybrid methods of thermal and depositi...
- Patent number 10,361,289
- Issue date Jul 23, 2019
- GLOBALFOUNDRIES Inc.
- Wei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 10,347,617
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated damascene interconnect structure for integrated circuits
- Patent number 10,319,630
- Issue date Jun 11, 2019
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 10,304,815
- Issue date May 28, 2019
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave annealing of flowable oxides with trap layers
- Patent number 10,211,045
- Issue date Feb 19, 2019
- GLOBALFOUNDRIES Inc.
- Rishikesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for overturned thin film device with self-ali...
- Patent number 10,026,849
- Issue date Jul 17, 2018
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon liner for STI CMP stop in FinFET
- Patent number 9,984,933
- Issue date May 29, 2018
- GLOBALFOUNDRIES Inc.
- Yiheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular fuses and antifuses for integrated circuits
- Patent number 9,905,511
- Issue date Feb 27, 2018
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned three dimensional chip stack and method for making the...
- Patent number 9,837,394
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench structure for high performance interconnection lines of diff...
- Patent number 9,786,551
- Issue date Oct 10, 2017
- STMicroelectronics, Inc.
- John Hongguang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having large self-aligned vias
- Patent number 9,658,523
- Issue date May 23, 2017
- STMicroelectronics, Inc.
- John H. Zhang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interconnect structure having large self-aligned vias
- Patent number 9,659,820
- Issue date May 23, 2017
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure in an integrated circuit for damage prevention...
- Patent number 9,646,939
- Issue date May 9, 2017
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for fabrication of microelectronic capacitors and resistors
- Patent number 9,633,986
- Issue date Apr 25, 2017
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit barrierless microfluidic channel
- Patent number 9,502,325
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and process for overturned thin film device with self-ali...
- Patent number 9,496,415
- Issue date Nov 15, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene sacrificial deposition layer on beol copper liner-seed for...
- Patent number 9,412,654
- Issue date Aug 9, 2016
- International Business Machines Corporation
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having large self-aligned vias
- Patent number 9,391,020
- Issue date Jul 12, 2016
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit barrierless microfluidic channel
- Patent number 9,385,062
- Issue date Jul 5, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for fabrication of microelectronic capacitors and resistors
- Patent number 9,385,177
- Issue date Jul 5, 2016
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit barrierless microfluidic channel
- Patent number 9,373,561
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to form conductive thin film structures
- Patent number 9,362,230
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure in an integrated circuit for damage prevention...
- Patent number 9,337,087
- Issue date May 10, 2016
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling the profile of an etched metallic layer
- Patent number 9,324,793
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FABRICATING MRAM WITH VOID FREE INTERLAYER DIELECTRIC
- Publication number 20240423093
- Publication date Dec 19, 2024
- HeFeChip Corporation Limited
- Chih Yuan LEE
Information Patent Application
METHODS FOR FABRICATING MAGNETORESISTIVE RANDOM ACCESS MEMORY
- Publication number 20240215457
- Publication date Jun 27, 2024
- HeFeChip Corporation Limited
- Wei-Chuan CHEN
Information Patent Application
FIN STRUCTURES
- Publication number 20200051867
- Publication date Feb 13, 2020
- GLOBALFOUNDRIES INC.
- Fuad H. AL-AMOODY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN REVEAL FORMING STI REGIONS HAVING CONVEX SHAPE BETWEEN FINS
- Publication number 20190214308
- Publication date Jul 11, 2019
- GLOBALFOUNDRIES INC.
- Yiheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH ISOLATION (STI) GAP FILL
- Publication number 20190027556
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- Jiehui Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS FOR OVERTURNED THIN FILM DEVICE WITH SELF-ALI...
- Publication number 20180226511
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECT WITH AIR GAP
- Publication number 20180144926
- Publication date May 24, 2018
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...
- Publication number 20180068994
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...
- Publication number 20180061817
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...
- Publication number 20170365590
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS FOR OVERTURNED THIN FILM DEVICE WITH SELF-ALI...
- Publication number 20170162711
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...
- Publication number 20170162554
- Publication date Jun 8, 2017
- STMicroelectronics, Inc.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR FABRICATION OF MICROELECTRONIC CAPACITORS AND RESISTORS
- Publication number 20160293589
- Publication date Oct 6, 2016
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL
- Publication number 20160254208
- Publication date Sep 1, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING LARGE SELF-ALIGNED VIAS
- Publication number 20160247722
- Publication date Aug 25, 2016
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER STRUCTURE IN AN INTEGRATED CIRCUIT FOR DAMAGE PREVENTION...
- Publication number 20160218070
- Publication date Jul 28, 2016
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL GATE ALL-AROUND TRANSISTOR
- Publication number 20160190312
- Publication date Jun 30, 2016
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL
- Publication number 20160181173
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL
- Publication number 20160181153
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR FUSES AND ANTIFUSES FOR INTEGRATED CIRCUITS
- Publication number 20160064326
- Publication date Mar 3, 2016
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING THE PROFILE OF AN ETCHED METALLIC LAYER
- Publication number 20160020105
- Publication date Jan 21, 2016
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR HIGH PERFORMANCE INTERCONNECTION LINES OF DIFF...
- Publication number 20150311113
- Publication date Oct 29, 2015
- STMicroelectronics, Inc.
- John Hongguang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING LARGE SELF-ALIGNED VIAS
- Publication number 20150279780
- Publication date Oct 1, 2015
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING LARGE SELF-ALIGNED VIAS
- Publication number 20150279784
- Publication date Oct 1, 2015
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING THE PROFILE OF AN ETCHED METALLIC LAYER
- Publication number 20150243510
- Publication date Aug 27, 2015
- STMicroelectronics, Inc.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING THROUGH IMPRINTING
- Publication number 20150162194
- Publication date Jun 11, 2015
- STMicroelectronics, Inc.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH INTERCONNECT HAVING REDUCED FRINGE CAPACITANCE
- Publication number 20150162278
- Publication date Jun 11, 2015
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECT WITH AIR GAP
- Publication number 20150162277
- Publication date Jun 11, 2015
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR FABRICATION OF MICROELECTRONIC CAPACITORS AND RESISTORS
- Publication number 20150115401
- Publication date Apr 30, 2015
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION OF VIAS
- Publication number 20150076695
- Publication date Mar 19, 2015
- STMicroelectronics, Inc.
- Tien-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Vertical gate all-around transistor

Fin reveal forming STI regions having convex shape between fins

Fin structures

Overturned thin film device with self-aligned gate and source/drain...

Advanced interconnect with air gap

Self-aligned three dimensional chip stack and method for making the...

Gate oxide formation through hybrid methods of thermal and depositi...

Self-aligned three dimensional chip stack and method for making the...

Encapsulated damascene interconnect structure for integrated circuits

Self-aligned three dimensional chip stack and method for making the...

Microwave annealing of flowable oxides with trap layers

Structure and process for overturned thin film device with self-ali...

Silicon liner for STI CMP stop in FinFET

Modular fuses and antifuses for integrated circuits

Self-aligned three dimensional chip stack and method for making the...

Trench structure for high performance interconnection lines of diff...

Interconnect structure having large self-aligned vias

Interconnect structure having large self-aligned vias

Multilayer structure in an integrated circuit for damage prevention...

Technique for fabrication of microelectronic capacitors and resistors

Integrated circuit barrierless microfluidic channel

Structure and process for overturned thin film device with self-ali...

Graphene sacrificial deposition layer on beol copper liner-seed for...

Interconnect structure having large self-aligned vias

Integrated circuit barrierless microfluidic channel

Technique for fabrication of microelectronic capacitors and resistors

Integrated circuit barrierless microfluidic channel

Methods to form conductive thin film structures

Multilayer structure in an integrated circuit for damage prevention...

Method for controlling the profile of an etched metallic layer

Patents Applicationslast 30 patents

METHODS FOR FABRICATING MRAM WITH VOID FREE INTERLAYER DIELECTRIC

METHODS FOR FABRICATING MAGNETORESISTIVE RANDOM ACCESS MEMORY

FIN STRUCTURES

FIN REVEAL FORMING STI REGIONS HAVING CONVEX SHAPE BETWEEN FINS

SHALLOW TRENCH ISOLATION (STI) GAP FILL

STRUCTURE AND PROCESS FOR OVERTURNED THIN FILM DEVICE WITH SELF-ALI...

ADVANCED INTERCONNECT WITH AIR GAP

SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...

SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...

SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...

STRUCTURE AND PROCESS FOR OVERTURNED THIN FILM DEVICE WITH SELF-ALI...

SELF-ALIGNED THREE DIMENSIONAL CHIP STACK AND METHOD FOR MAKING THE...

TECHNIQUE FOR FABRICATION OF MICROELECTRONIC CAPACITORS AND RESISTORS

INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL

INTERCONNECT STRUCTURE HAVING LARGE SELF-ALIGNED VIAS

MULTILAYER STRUCTURE IN AN INTEGRATED CIRCUIT FOR DAMAGE PREVENTION...

VERTICAL GATE ALL-AROUND TRANSISTOR

INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL

INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL

MODULAR FUSES AND ANTIFUSES FOR INTEGRATED CIRCUITS

METHOD FOR CONTROLLING THE PROFILE OF AN ETCHED METALLIC LAYER

TRENCH STRUCTURE FOR HIGH PERFORMANCE INTERCONNECTION LINES OF DIFF...

INTERCONNECT STRUCTURE HAVING LARGE SELF-ALIGNED VIAS

INTERCONNECT STRUCTURE HAVING LARGE SELF-ALIGNED VIAS

METHOD FOR CONTROLLING THE PROFILE OF AN ETCHED METALLIC LAYER

PATTERNING THROUGH IMPRINTING

TRENCH INTERCONNECT HAVING REDUCED FRINGE CAPACITANCE

ADVANCED INTERCONNECT WITH AIR GAP

TECHNIQUE FOR FABRICATION OF MICROELECTRONIC CAPACITORS AND RESISTORS

SELECTIVE PASSIVATION OF VIAS