TREA

Yihui Lee

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 9,786,561
    • Issue date Oct 10, 2017
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,478,465
    • Issue date Oct 25, 2016
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160163597
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160104643
    • Publication date Apr 14, 2016
    • Disco Corporation
    • Yohei Yamashita
    • H01 - BASIC ELECTRIC ELEMENTS