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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
Patent number
11,955,426
Issue date
Apr 9, 2024
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,923,307
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic structures in integrated circuit package supports
Patent number
11,830,809
Issue date
Nov 28, 2023
Intel Corporation
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual trace thickness for single layer routing
Patent number
11,769,719
Issue date
Sep 26, 2023
Intel Corporation
Jonathan Rosch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die cavity package
Patent number
11,705,377
Issue date
Jul 18, 2023
Intel Corporation
Mitul Modi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
Patent number
11,696,407
Issue date
Jul 4, 2023
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic core inductors
Patent number
11,651,885
Issue date
May 16, 2023
Intel Corporation
Junnan Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including a lateral trace
Patent number
11,646,254
Issue date
May 9, 2023
Tahoe Research, LTD.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Helical plated through-hole package inductor
Patent number
11,608,564
Issue date
Mar 21, 2023
Intel Corporation
William J. Lambert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having a cooling channel
Patent number
11,521,914
Issue date
Dec 6, 2022
Intel Corporation
Zhimin Wan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Effective heat conduction from hotspot to heat spreader through pac...
Patent number
11,502,017
Issue date
Nov 15, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic bilayer structure for a cored or coreless semiconductor pa...
Patent number
11,495,555
Issue date
Nov 8, 2022
Intel Corporation
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management solutions for integrated circuit packages
Patent number
11,482,471
Issue date
Oct 25, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic structures in integrated circuit packages
Patent number
11,444,042
Issue date
Sep 13, 2022
Intel Corporation
Andrew James Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer embedded magnetic inductor coil
Patent number
11,404,364
Issue date
Aug 2, 2022
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
Patent number
11,393,751
Issue date
Jul 19, 2022
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Phase change material in substrate cavity
Patent number
11,387,224
Issue date
Jul 12, 2022
Intel Corporation
Cheng Xu
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Microelectronic assemblies having conductive structures with differ...
Patent number
11,380,609
Issue date
Jul 5, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die cavity package
Patent number
11,328,968
Issue date
May 10, 2022
Intel Corporation
Mitul Modi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a first level interface
Patent number
11,322,290
Issue date
May 3, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus with embedded fine line space in a cavity, and a method f...
Patent number
11,272,619
Issue date
Mar 8, 2022
Intel Corporation
Kristof Darmawikarta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
Patent number
11,246,218
Issue date
Feb 8, 2022
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a second level interface
Patent number
11,031,360
Issue date
Jun 8, 2021
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making an inductor
Patent number
10,998,120
Issue date
May 4, 2021
Intel Corporation
William J. Lambert
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Electronic device including a lateral trace
Patent number
10,804,188
Issue date
Oct 13, 2020
Intel Corporation
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package substrate with through-hole magnetic core ind...
Patent number
10,790,159
Issue date
Sep 29, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a second level interface
Patent number
10,777,514
Issue date
Sep 15, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for semiconductor packages using photoimageable...
Patent number
10,553,453
Issue date
Feb 4, 2020
Intel Corporation
Sri Chaitra Chavali
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate assembly with magnetic feature
Patent number
10,396,046
Issue date
Aug 27, 2019
Intel Corporation
Yikang Deng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic substrate having embedded trace layers with integra...
Patent number
10,361,165
Issue date
Jul 23, 2019
Intel Corporation
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
Publication number
20230369192
Publication date
Nov 16, 2023
Intel Corporation
Jonathan ROSCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
Publication number
20230352385
Publication date
Nov 2, 2023
Tahoe Research, Ltd.
Yikang DENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
Publication number
20230187205
Publication date
Jun 15, 2023
Intel Corporation
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
Publication number
20220310512
Publication date
Sep 29, 2022
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFER...
Publication number
20220278038
Publication date
Sep 1, 2022
Intel Corporation
Ji Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE CAVITY PACKAGE
Publication number
20220238402
Publication date
Jul 28, 2022
Intel Corporation
Mitul MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
Publication number
20220230800
Publication date
Jul 21, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHOD F...
Publication number
20220183157
Publication date
Jun 9, 2022
Intel Corporation
Kristof Darmawikarta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
Publication number
20220117089
Publication date
Apr 14, 2022
Intel Corporation
Chong ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20210391263
Publication date
Dec 16, 2021
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AN APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHO...
Publication number
20210307172
Publication date
Sep 30, 2021
Intel Corporation
Kristof Darmawikarta
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
Publication number
20210305154
Publication date
Sep 30, 2021
Intel Corporation
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR
Publication number
20210304952
Publication date
Sep 30, 2021
Intel Corporation
William J. Lambert
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
IN-PLANE INDUCTORS IN IC PACKAGES
Publication number
20210273036
Publication date
Sep 2, 2021
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
Publication number
20210020558
Publication date
Jan 21, 2021
Intel Corporation
Yikang DENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE
Publication number
20200411413
Publication date
Dec 31, 2020
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
Publication number
20200373257
Publication date
Nov 26, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
Publication number
20200312738
Publication date
Oct 1, 2020
Intel Corporation
Junnan Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20200273776
Publication date
Aug 27, 2020
Intel Corporation
Cheng Xu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
Publication number
20200211927
Publication date
Jul 2, 2020
Intel Corporation
Zhimin Wan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PAC...
Publication number
20200185300
Publication date
Jun 11, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE CAVITY PACKAGE
Publication number
20200185289
Publication date
Jun 11, 2020
Intel Corporation
Mitul MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC CORE INDUCTORS
Publication number
20200168384
Publication date
May 28, 2020
Intel Corporation
Junnan Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
Publication number
20200118990
Publication date
Apr 16, 2020
Intel Corporation
Cheng Xu
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING
Publication number
20200119250
Publication date
Apr 16, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
Publication number
20200083153
Publication date
Mar 12, 2020
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER EMBEDDED MAGNETIC INDUCTOR COIL
Publication number
20200066627
Publication date
Feb 27, 2020
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-INTEGRATED MULTI-TURN COIL EMBEDDED IN A PACKAGE MAGNETIC CORE
Publication number
20200066634
Publication date
Feb 27, 2020
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
Publication number
20200027728
Publication date
Jan 23, 2020
Intel Corporation
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
Publication number
20190393143
Publication date
Dec 26, 2019
Intel Corporation
Jonathan ROSCH
H01 - BASIC ELECTRIC ELEMENTS