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Yin-Chen Lin

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  • Miaoli County, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Double-sided flexible circuit board
    • Patent number 12,089,326
    • Issue date Sep 10, 2024
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board tape and joining method thereof
    • Patent number 11,602,047
    • Issue date Mar 7, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flexible circuit board
    • Patent number 11,206,735
    • Issue date Dec 21, 2021
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flexible circuit board
    • Patent number 11,178,756
    • Issue date Nov 16, 2021
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Double-sided flexible circuit board and layout structure thereof
    • Patent number 11,177,206
    • Issue date Nov 16, 2021
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flexible substrate
    • Patent number 9,247,635
    • Issue date Jan 26, 2016
    • Chipbond Technology Corporation
    • Yi-Wen Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
    • Publication number 20240014118
    • Publication date Jan 11, 2024
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230039895
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230044473
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD TAPE AND JOINING METHOD THEREOF
    • Publication number 20220087017
    • Publication date Mar 17, 2022
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20210267049
    • Publication date Aug 26, 2021
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD AND LAYOUT STRUCTURE THEREOF
    • Publication number 20210159159
    • Publication date May 27, 2021
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE SUBSTRATE
    • Publication number 20150359085
    • Publication date Dec 10, 2015
    • Chipbond Technology Corporation
    • Yi-Wen Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR