Yin-Hua Chen

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Yuanlin Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming a device having a capped through-substrate via...
- Patent number 9,847,256
- Issue date Dec 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with capped through-substrate via structure
- Patent number 9,514,986
- Issue date Dec 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device with Through-Substrate Via Structure and Method for Forming...
- Publication number 20170084489
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device with Through-Substrate Via Structure and Method for Forming...
- Publication number 20150061147
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS