Yin-Ju Chen

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Jiangsu, CN

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282683
- Publication date Aug 22, 2024
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240243048
- Publication date Jul 18, 2024
- AaltoSemi Inc.
- Andrew C. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240213137
- Publication date Jun 27, 2024
- AaltoSemi Inc.
- Andrew C. Chang
- H01 - BASIC ELECTRIC ELEMENTS