Ying-Che Shih

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated fan-out packages with built-in heat sink
- Patent number 12,148,661
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 12,080,617
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,074,119
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor epitaxy structure
- Patent number 12,051,724
- Issue date Jul 30, 2024
- GlobalWafers Co., Ltd.
- Tzu-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,033,978
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions
- Patent number 12,033,968
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 12,021,008
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die placement without backside chipping
- Patent number 11,990,429
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structure having super-lattice laminates
- Patent number 11,923,454
- Issue date Mar 5, 2024
- GlobalWafers Co., Ltd.
- Wei-Jie Sie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test kit for testing a device under test
- Patent number 11,879,934
- Issue date Jan 23, 2024
- Mediatek Inc.
- Jing-Hui Zhuang
- G01 - MEASURING TESTING
Information Patent Grant
Floating electrical connector
- Patent number 11,855,388
- Issue date Dec 26, 2023
- Alpha Networks Inc.
- Chih-Kuang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 11,842,936
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component, electronic device and manufacturing method thereof
- Patent number 11,824,040
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,810,831
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wafer structure and method of manufacturing the same
- Patent number 11,757,003
- Issue date Sep 12, 2023
- GlobalWafers Co., Ltd.
- Ying-Ru Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of manufacturing the same
- Patent number 11,749,607
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through chip-on-wafer-on-substrate
- Patent number 11,728,254
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,694,975
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing epitaxy substrate
- Patent number 11,688,628
- Issue date Jun 27, 2023
- GlobalWafers Co., Ltd.
- Ying-Ru Shih
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plurality of stacked pillar portions on a semiconductor structure
- Patent number 11,682,645
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test kit for testing a device under test
- Patent number 11,624,758
- Issue date Apr 11, 2023
- Mediatek Inc.
- Sheng-Wei Lei
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371945
- Publication date Nov 7, 2024
- GLOBALWAFERS CO., LTD.
- Ying-Ru Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...
- Publication number 20240332113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR...
- Publication number 20240321796
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312940
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEED CRYSTAL
- Publication number 20240262084
- Publication date Aug 8, 2024
- GLOBALWAFERS CO., LTD.
- Ray-Hua Horng
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234372
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER GRINDING PARAMETER OPTIMIZATION METHOD AND ELECTRONIC DEVICE
- Publication number 20240173819
- Publication date May 30, 2024
- GLOBALWAFERS CO., LTD.
- Chih-Chun Cheng
- B24 - GRINDING POLISHING
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240136293
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
- Publication number 20240107780
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105701
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- Publication number 20240096732
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240096848
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071849
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071855
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071857
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055315
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240055324
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Ying-Che Shih

Person

Patents Grantslast 30 patents

Shift control method in manufacture of semiconductor device

Method of forming integrated fan-out packages with built-in heat sink

Package structure

Joint structure in semiconductor package and manufacturing method t...

Underfill structure for semiconductor packages and methods of formi...

Chip package structure

Semiconductor epitaxy structure

Semiconductor package and manufacturing method thereof

Package structure with bridge die laterally wrapped by insulating e...

Package structure including stacked pillar portions

Thermal interface materials, 3D semiconductor packages and methods...

Integrated circuit package and method of forming same

Dummy die placement without backside chipping

Semiconductor package and manufacturing method thereof

Giga interposer integration through Chip-On-Wafer-On-Substrate

Package structure

Epitaxial structure having super-lattice laminates

Test kit for testing a device under test

Floating electrical connector

Semiconductor device and manufacturing method of the same

Underfill structure for semiconductor packages and methods of formi...

Package component, electronic device and manufacturing method thereof

Integrated circuit package and method of forming same

Bonding wafer structure and method of manufacturing the same

Package and method of manufacturing the same

Giga interposer integration through chip-on-wafer-on-substrate

Chip package structure

Method of manufacturing epitaxy substrate

Plurality of stacked pillar portions on a semiconductor structure

Test kit for testing a device under test

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SILICON CARBIDE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SILICON CARBIDE SEED CRYSTAL

METHOD OF FORMING PACKAGE STRUCTURE

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

WAFER GRINDING PARAMETER OPTIMIZATION METHOD AND ELECTRONIC DEVICE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE AND FABRICATION METHOD THEREOF