Ying-Cheng Tseng

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for managing temperature in semiconductor fabrication facility
- Patent number 12,170,208
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Otto Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,113,022
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 12,062,539
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, package-on-package structure and method of fabri...
- Patent number 12,015,017
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,929,318
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and forming method thereof
- Patent number 11,855,232
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of fingerprint sensor
- Patent number 11,847,852
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,842,993
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method
- Patent number 11,742,254
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 11,705,328
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 11,631,658
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor
- Patent number 11,580,767
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,527,525
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and test method thereof
- Patent number 11,442,485
- Issue date Sep 13, 2022
- Novatek Microelectronics Corp.
- Yi-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and forming method thereof
- Patent number 11,374,136
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 11,355,466
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
- Patent number 11,289,330
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control system for fully automatic turntable
- Patent number 11,217,271
- Issue date Jan 4, 2022
- Hanpin Electron Co., Ltd.
- Shen-Keng Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,164,819
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having sensor die with touch sensing electrode, a...
- Patent number 11,158,555
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging apparatus and related control unit
- Patent number 11,062,875
- Issue date Jul 13, 2021
- City University of Hong Kong
- Fu-Rong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding the strip-shaped under bump metallization struct...
- Patent number 11,049,850
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, package-on-package structure and method of fabri...
- Patent number 11,011,501
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,004,786
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron gun and apparatus incorporating the same
- Patent number 10,916,399
- Issue date Feb 9, 2021
- City University of Hong Kong
- Fu-Rong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 10,861,841
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 10,840,227
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method
- Patent number 10,832,985
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240371776
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20240355618
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297163
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240194591
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
- Publication number 20240088307
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230395490
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGES
- Publication number 20230352357
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20230307231
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
- Publication number 20230253384
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20230207472
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DEVICE AND METHOD OF USING THE SAME
- Publication number 20230155341
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hua HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FINGERPRINT SENSOR
- Publication number 20230126259
- Publication date Apr 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
- Publication number 20230110420
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANAGING TEMPERATURE IN SEMICONDUCTOR FABRICATION FACILITY
- Publication number 20220384214
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- OTTO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
- Publication number 20220285566
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20220262758
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20220216053
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND TEST METHOD THEREOF
- Publication number 20220011803
- Publication date Jan 13, 2022
- NOVATEK MICROELECTRONICS CORP.
- Yi-Hsuan Cheng
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20210375765
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210280511
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE , PACKAGE-ON-PACKAGE STRUCTURE AND METHOD OF FABR...
- Publication number 20210272941
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
- Publication number 20210242159
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS AND RELATED CONTROL UNIT
- Publication number 20210110990
- Publication date Apr 15, 2021
- City University of Hong Kong
- Fu-Rong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PROVIDING ELECTRONS AND METHOD FOR MAKING THE SAME
- Publication number 20210104376
- Publication date Apr 8, 2021
- City University of Hong Kong
- Fu-Rong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
- Publication number 20210098253
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
- Publication number 20210098636
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Multiple Polarity Groups
- Publication number 20210091065
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under-Bump-Metallization Structure and Redistribution Layer Design...
- Publication number 20210074694
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Package and Method
- Publication number 20210057302
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Ying-Cheng Tseng

Person

Patents Grantslast 30 patents

Sensor packages

Method for managing temperature in semiconductor fabrication facility

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor-on-insulator (SOI) substrate and method for forming

Package structure and manufacturing method of package structure the...

Package structure, package-on-package structure and method of fabri...

Package structure and method of forming the same

Semiconductor package and forming method thereof

Manufacturing method of fingerprint sensor

Semiconductor device with multiple polarity groups

Sensor package and method

Semiconductor-on-insulator (SOI) substrate and method for forming

Under-bump-metallization structure and redistribution layer design...

Fingerprint sensor

Semiconductor device with multiple polarity groups

Integrated circuit chip and test method thereof

Semiconductor package and forming method thereof

Package structure and manufacturing method of package structure the...

Semiconductor-on-insulator (SOI) substrate and method for forming

Control system for fully automatic turntable

Semiconductor package and manufacturing method thereof

Package structure having sensor die with touch sensing electrode, a...

Imaging apparatus and related control unit

Methods of bonding the strip-shaped under bump metallization struct...

Package structure, package-on-package structure and method of fabri...

Package structure and method of forming the same

Electron gun and apparatus incorporating the same

Semiconductor device with multiple polarity groups

Under-bump-metallization structure and redistribution layer design...

Sensor package and method

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

METHOD OF FABRICATING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SENSOR PACKAGES

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

LASER DEVICE AND METHOD OF USING THE SAME

MANUFACTURING METHOD OF FINGERPRINT SENSOR

SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS

METHOD FOR MANAGING TEMPERATURE IN SEMICONDUCTOR FABRICATION FACILITY

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

INTEGRATED CIRCUIT CHIP AND TEST METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE , PACKAGE-ON-PACKAGE STRUCTURE AND METHOD OF FABR...

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...

IMAGING APPARATUS AND RELATED CONTROL UNIT

DEVICE FOR PROVIDING ELECTRONS AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

Semiconductor Device with Multiple Polarity Groups

Under-Bump-Metallization Structure and Redistribution Layer Design...

Sensor Package and Method