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last 30 patents
Information
Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
Patent number
12,062,539
Issue date
Aug 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method of package structure the...
Patent number
12,051,666
Issue date
Jul 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure, package-on-package structure and method of fabri...
Patent number
12,015,017
Issue date
Jun 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,929,318
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and forming method thereof
Patent number
11,855,232
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of fingerprint sensor
Patent number
11,847,852
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device with multiple polarity groups
Patent number
11,842,993
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package and method
Patent number
11,742,254
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Hsien Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
Patent number
11,705,328
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under-bump-metallization structure and redistribution layer design...
Patent number
11,631,658
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fingerprint sensor
Patent number
11,580,767
Issue date
Feb 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device with multiple polarity groups
Patent number
11,527,525
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip and test method thereof
Patent number
11,442,485
Issue date
Sep 13, 2022
Novatek Microelectronics Corp.
Yi-Hsuan Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and forming method thereof
Patent number
11,374,136
Issue date
Jun 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method of package structure the...
Patent number
11,355,466
Issue date
Jun 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-on-insulator (SOI) substrate and method for forming
Patent number
11,289,330
Issue date
Mar 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Control system for fully automatic turntable
Patent number
11,217,271
Issue date
Jan 4, 2022
Hanpin Electron Co., Ltd.
Shen-Keng Liu
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,164,819
Issue date
Nov 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure having sensor die with touch sensing electrode, a...
Patent number
11,158,555
Issue date
Oct 26, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Ting Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Imaging apparatus and related control unit
Patent number
11,062,875
Issue date
Jul 13, 2021
City University of Hong Kong
Fu-Rong Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of bonding the strip-shaped under bump metallization struct...
Patent number
11,049,850
Issue date
Jun 29, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure, package-on-package structure and method of fabri...
Patent number
11,011,501
Issue date
May 18, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,004,786
Issue date
May 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electron gun and apparatus incorporating the same
Patent number
10,916,399
Issue date
Feb 9, 2021
City University of Hong Kong
Fu-Rong Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with multiple polarity groups
Patent number
10,861,841
Issue date
Dec 8, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under-bump-metallization structure and redistribution layer design...
Patent number
10,840,227
Issue date
Nov 17, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor package and method
Patent number
10,832,985
Issue date
Nov 10, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Hsien Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fingerprint sensor and manufacturing method thereof
Patent number
10,762,319
Issue date
Sep 1, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Hsuan Tai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor devices having a plurality of first and second conduc...
Patent number
10,658,348
Issue date
May 19, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
10,074,615
Issue date
Sep 11, 2018
Taiwan Semiconductor Manufacturing Co., Ltd
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
Publication number
20240297163
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240194591
Publication date
Jun 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
Publication number
20240088307
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230395490
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGES
Publication number
20230352357
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Hsien Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
Publication number
20230307231
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
Publication number
20230253384
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
Publication number
20230207472
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER DEVICE AND METHOD OF USING THE SAME
Publication number
20230155341
Publication date
May 18, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Hua HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF FINGERPRINT SENSOR
Publication number
20230126259
Publication date
Apr 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
Publication number
20230110420
Publication date
Apr 13, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANAGING TEMPERATURE IN SEMICONDUCTOR FABRICATION FACILITY
Publication number
20220384214
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing company Ltd.
OTTO CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
Publication number
20220285566
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
Publication number
20220262758
Publication date
Aug 18, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
Publication number
20220216053
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP AND TEST METHOD THEREOF
Publication number
20220011803
Publication date
Jan 13, 2022
NOVATEK MICROELECTRONICS CORP.
Yi-Hsuan Cheng
G05 - CONTROLLING REGULATING
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
Publication number
20210375765
Publication date
Dec 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20210280511
Publication date
Sep 9, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE , PACKAGE-ON-PACKAGE STRUCTURE AND METHOD OF FABR...
Publication number
20210272941
Publication date
Sep 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THE...
Publication number
20210242159
Publication date
Aug 5, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGING APPARATUS AND RELATED CONTROL UNIT
Publication number
20210110990
Publication date
Apr 15, 2021
City University of Hong Kong
Fu-Rong Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE FOR PROVIDING ELECTRONS AND METHOD FOR MAKING THE SAME
Publication number
20210104376
Publication date
Apr 8, 2021
City University of Hong Kong
Fu-Rong Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE AND METHOD FOR FORMING
Publication number
20210098253
Publication date
Apr 1, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Cheng-Ta Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
Publication number
20210098636
Publication date
Apr 1, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Multiple Polarity Groups
Publication number
20210091065
Publication date
Mar 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Under-Bump-Metallization Structure and Redistribution Layer Design...
Publication number
20210074694
Publication date
Mar 11, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sensor Package and Method
Publication number
20210057302
Publication date
Feb 25, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Hsien Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR
Publication number
20200410198
Publication date
Dec 31, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hsuan Tai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200381362
Publication date
Dec 3, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Cheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20200294912
Publication date
Sep 17, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS