Ying-Chih Chan

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier substrate
- Patent number 9,491,871
- Issue date Nov 8, 2016
- Unimicron Technology Corp.
- Ying-Chih Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having a through-holed interposer
- Patent number 9,460,992
- Issue date Oct 4, 2016
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate and method of fabricating the same
- Patent number 9,408,313
- Issue date Aug 2, 2016
- Unimicron Technology Corp.
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a through-holed interposer
- Patent number 9,337,136
- Issue date May 10, 2016
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating packaging substrate having a through-holed in...
- Patent number 9,224,683
- Issue date Dec 29, 2015
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate
- Patent number 9,111,818
- Issue date Aug 18, 2015
- Unimicron Technology Corporation
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-holed interposer, packaging substrate, and methods of fabri...
- Patent number 8,981,570
- Issue date Mar 17, 2015
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package structure and fabrication method thereof
- Patent number 8,502,370
- Issue date Aug 6, 2013
- Unimicron Technology Corporation
- Ying-Chih Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER SUBSTRATE
- Publication number 20160113114
- Publication date Apr 21, 2016
- Unimicron Technology Corp.
- Ying-Chih Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE HAVING A THROUGH-HOLED INTERPOSER
- Publication number 20150187692
- Publication date Jul 2, 2015
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A THROUGH-HOLED IN...
- Publication number 20150179475
- Publication date Jun 25, 2015
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A THROUGH-HOLED INTERPOSER
- Publication number 20150179476
- Publication date Jun 25, 2015
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20140182913
- Publication date Jul 3, 2014
- Unimicron Technology Corp.
- Chun-Ting LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE
- Publication number 20140182912
- Publication date Jul 3, 2014
- Unimicron Technology Corporation
- Chun-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLED INTERPOSER, PACKAGING SUBSTRATE, AND METHODS OF FABRI...
- Publication number 20140027925
- Publication date Jan 30, 2014
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE
- Publication number 20130249083
- Publication date Sep 26, 2013
- Unimicron Technology Corporation
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20130147041
- Publication date Jun 13, 2013
- Unimicron Technology Corporation
- Ying-Chih CHAN
- H01 - BASIC ELECTRIC ELEMENTS

Ying-Chih Chan

Person

Patents Grantslast 30 patents

Carrier substrate

Packaging substrate having a through-holed interposer

Packaging substrate and method of fabricating the same

Method of fabricating a through-holed interposer

Method of fabricating packaging substrate having a through-holed in...

Packaging substrate

Through-holed interposer, packaging substrate, and methods of fabri...

Stack package structure and fabrication method thereof

Patents Applicationslast 30 patents

CARRIER SUBSTRATE

PACKAGING SUBSTRATE HAVING A THROUGH-HOLED INTERPOSER

METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING A THROUGH-HOLED IN...

METHOD OF FABRICATING A THROUGH-HOLED INTERPOSER

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

PACKAGING SUBSTRATE

THROUGH-HOLED INTERPOSER, PACKAGING SUBSTRATE, AND METHODS OF FABRI...

PACKAGING SUBSTRATE

STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF