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Taichung City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
12,015,059
Issue date
Jun 18, 2024
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolation structure and manufacturing method thereof
Patent number
11,972,972
Issue date
Apr 30, 2024
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of memory device
Patent number
11,908,953
Issue date
Feb 20, 2024
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resistive random access memory and manufacturing method thereoff
Patent number
11,637,241
Issue date
Apr 25, 2023
Winbond Electronics Corp.
Meng-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device and manufacturing method thereof
Patent number
11,575,051
Issue date
Feb 7, 2023
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method for memory structure
Patent number
11,538,818
Issue date
Dec 27, 2022
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory structure and manufacturing method therefor
Patent number
11,121,142
Issue date
Sep 14, 2021
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming the same
Patent number
11,101,177
Issue date
Aug 24, 2021
Winbond Electronics Corp.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230335602
Publication date
Oct 19, 2023
WINBOND ELECTRONICS CORP.
Che-Jui HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF MEMORY DEVICE
Publication number
20230121256
Publication date
Apr 20, 2023
WINBOND ELECTRONICS CORP.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATION STRUCTUE AND MANUFACTURING METHOD THEREOF
Publication number
20220139764
Publication date
May 5, 2022
WINBOND ELECTRONICS CORP.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR MEMORY STRUCTURE
Publication number
20210351194
Publication date
Nov 11, 2021
WINBOND ELECTRONICS CORP.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20210257257
Publication date
Aug 19, 2021
WINBOND ELECTRONICS CORP.
Che-Jui HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20210202512
Publication date
Jul 1, 2021
WINBOND ELECTRONICS CORP.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOFF
Publication number
20210175421
Publication date
Jun 10, 2021
WINBOND ELECTRONICS CORP.
Meng-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20210066493
Publication date
Mar 4, 2021
WINBOND ELECTRONICS CORP.
Che-Jui Hsu
H01 - BASIC ELECTRIC ELEMENTS