Ying-Hsin Kuo

Person

Zhubei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for erasing flash memory
- Patent number 12,237,017
- Issue date Feb 25, 2025
- Winbond Electronics Corp.
- Lung-Chi Cheng
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and manufacturing method
- Patent number 12,193,205
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lo
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and manufacturing method
- Patent number 11,683,924
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 11,658,044
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 11,626,434
- Issue date Apr 11, 2023
- OmniVision Technologies, Inc.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 11,574,886
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory storage apparatus and operating method thereof
- Patent number 11,437,101
- Issue date Sep 6, 2022
- Winbond Electronics Corp.
- Lih-Wei Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Optical bench, method of making and method of using
- Patent number 11,415,762
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Hao Kuo
- G02 - OPTICS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and data writing method
- Patent number 11,289,160
- Issue date Mar 29, 2022
- Winbond Electronics Corp.
- Lih-Wei Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and manufacturing method
- Patent number 11,282,842
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lo
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,243,353
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 11,211,414
- Issue date Dec 28, 2021
- OmniVision Technologies, Inc.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavityless chip-scale image-sensor package
- Patent number 11,114,483
- Issue date Sep 7, 2021
- OmniVision Technologies, Inc.
- Chien-Chan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package using carbon nano material...
- Patent number 11,088,058
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bio-chip package with waveguide integrated spectrometer
- Patent number 11,060,977
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui Hsieh Lai
- G01 - MEASURING TESTING
Information Patent Grant
Image-sensor chip-scale package and method for manufacture
- Patent number 11,056,529
- Issue date Jul 6, 2021
- OmniVision Technologies, Inc.
- Chien-Chan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Code pattern for representing tracing number of chip
- Patent number 10,998,285
- Issue date May 4, 2021
- OmniVision Technologies, Inc.
- Chien-Chan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,985,149
- Issue date Apr 20, 2021
- OmniVision Technologies, Inc.
- Chien Chan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion promoter apparatus and method
- Patent number 10,983,278
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Tseng
- G02 - OPTICS
Information Patent Grant
Resistive memory apparatus and adjusting method for write-in voltag...
- Patent number 10,978,149
- Issue date Apr 13, 2021
- Winbond Electronics Corp.
- Ju-Chieh Cheng
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 10,957,559
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etchant and etching process for substrate of a semiconductor device
- Patent number 10,866,362
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a metal grating in a waveguide and device formed
- Patent number 10,866,361
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui Hsieh Lai
- G02 - OPTICS
Information Patent Grant
Optical bench on substrate and method of making the same
- Patent number 10,866,374
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having strap cell
- Patent number 10,868,019
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optic modulator device, optical device and method of making...
- Patent number 10,859,860
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lee
- G02 - OPTICS
Information Patent Grant
Thermally conductive molding compound structure for heat dissipatio...
- Patent number 10,861,817
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 10,840,231
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh Lai
- G02 - OPTICS
Information Patent Grant
Memory device and manufacturing method
- Patent number 10,840,251
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hung Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY DEVICE AND ERASING METHOD THEREOF
- Publication number 20240290400
- Publication date Aug 29, 2024
- WINBOND ELECTRONICS CORP.
- Ying-Shan KUO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR ERASING FLASH MEMORY
- Publication number 20230274782
- Publication date Aug 31, 2023
- WINBOND ELECTRONICS CORP.
- Lung-Chi Cheng
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD
- Publication number 20230276608
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung LO
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD
- Publication number 20220208774
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung LO
- G11 - INFORMATION STORAGE
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20220077210
- Publication date Mar 10, 2022
- OMNIVISION TECHNOLOGIES, INC.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE MEMORY STORAGE APPARATUS AND OPERATING METHOD THEREOF
- Publication number 20210335421
- Publication date Oct 28, 2021
- WINBOND ELECTRONICS CORP.
- Lih-Wei Lin
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND DATA WRITING METHOD
- Publication number 20210210139
- Publication date Jul 8, 2021
- WINBOND ELECTRONICS CORP.
- Lih-Wei LIN
- G11 - INFORMATION STORAGE
Information Patent Application
THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...
- Publication number 20210202270
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20210193716
- Publication date Jun 24, 2021
- OMNIVISION TECHNOLOGIES, INC.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE-SENSOR CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURE
- Publication number 20210111221
- Publication date Apr 15, 2021
- OMNIVISION TECHNOLOGIES, INC.
- Chien-Chan YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20210104485
- Publication date Apr 8, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BENCH, METHOD OF MAKING AND METHOD OF USING
- Publication number 20210088737
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Hao KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD
- Publication number 20210066312
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung LO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STRAP CELL
- Publication number 20200266200
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung LO
- G11 - INFORMATION STORAGE
Information Patent Application
CODE PATTERN FOR REPRESENTING TRACING NUMBER OF CHIP
- Publication number 20200243472
- Publication date Jul 30, 2020
- OMNIVISION TECHNOLOGIES, INC.
- Chien-Chan Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200227394
- Publication date Jul 16, 2020
- OMNIVISION TECHNOLOGIES, INC.
- Chien Chan YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20200132932
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Hao Kuo
- G02 - OPTICS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD
- Publication number 20200135742
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung LO
- G11 - INFORMATION STORAGE
Information Patent Application
Bio-Chip Package with Waveguide Integrated Spectrometer
- Publication number 20200110035
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh LAI
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20200083208
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh Lai
- G02 - OPTICS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20200066671
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making a Metal Grating in a Waveguide and Device Formed
- Publication number 20200049883
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh LAI
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...
- Publication number 20200043838
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...
- Publication number 20200020658
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...
- Publication number 20200013636
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STRAP CELL
- Publication number 20190363094
- Publication date Nov 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hung LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside-Illuminated Photodetector Structure and Method of Making t...
- Publication number 20190341508
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etchant and Etching Process for Substrate of a Semiconductor Device
- Publication number 20190293868
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRC...
- Publication number 20190237379
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Methods of Forming Same
- Publication number 20190219762
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Hsieh Lai
- G02 - OPTICS

Ying-Hsin Kuo

Person

Patents Grantslast 30 patents

Method for erasing flash memory

Memory device and manufacturing method

Memory device and manufacturing method

Thermally conductive structure for heat dissipation in semiconducto...

Image sensor package

Thermally conductive molding compound structure for heat dissipatio...

Resistive memory storage apparatus and operating method thereof

Optical bench, method of making and method of using

Temporary bonding scheme

Memory device and data writing method

Memory device and manufacturing method

Semiconductor device and method of manufacturing

Image sensor package

Cavityless chip-scale image-sensor package

Method for forming semiconductor package using carbon nano material...

Bio-chip package with waveguide integrated spectrometer

Image-sensor chip-scale package and method for manufacture

Code pattern for representing tracing number of chip

Semiconductor device package and method of manufacturing the same

Adhesion promoter apparatus and method

Resistive memory apparatus and adjusting method for write-in voltag...

Thermally conductive structure for heat dissipation in semiconducto...

Etchant and etching process for substrate of a semiconductor device

Method of making a metal grating in a waveguide and device formed

Optical bench on substrate and method of making the same

Semiconductor device having strap cell

Electro-optic modulator device, optical device and method of making...

Thermally conductive molding compound structure for heat dissipatio...

Semiconductor device and method of manufacturing

Memory device and manufacturing method

Patents Applicationslast 30 patents

MEMORY DEVICE AND ERASING METHOD THEREOF

METHOD FOR ERASING FLASH MEMORY

MEMORY DEVICE AND MANUFACTURING METHOD

MEMORY DEVICE AND MANUFACTURING METHOD

IMAGE SENSOR PACKAGE

RESISTIVE MEMORY STORAGE APPARATUS AND OPERATING METHOD THEREOF

MEMORY DEVICE AND DATA WRITING METHOD

THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...

IMAGE SENSOR PACKAGE

IMAGE-SENSOR CHIP-SCALE PACKAGE AND METHOD FOR MANUFACTURE

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

OPTICAL BENCH, METHOD OF MAKING AND METHOD OF USING

MEMORY DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE HAVING STRAP CELL

CODE PATTERN FOR REPRESENTING TRACING NUMBER OF CHIP

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Manufacturing

MEMORY DEVICE AND MANUFACTURING METHOD

Bio-Chip Package with Waveguide Integrated Spectrometer

Semiconductor Device and Method of Manufacturing

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

Method of Making a Metal Grating in a Waveguide and Device Formed

METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL...

THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATIO...

THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTO...

SEMICONDUCTOR DEVICE HAVING STRAP CELL

Backside-Illuminated Photodetector Structure and Method of Making t...

Etchant and Etching Process for Substrate of a Semiconductor Device

PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRC...

Package Structure and Methods of Forming Same