Ying Ji

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Distributed on-chip decoupling apparatus and method using package i...
- Patent number 9,870,982
- Issue date Jan 16, 2018
- Rambus Inc.
- David Secker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed on-chip decoupling apparatus and method using package i...
- Patent number 9,466,568
- Issue date Oct 11, 2016
- Rambus Inc.
- David Secker
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Distributed on-chip decoupling apparatus and method using package i...
- Patent number 9,006,907
- Issue date Apr 14, 2015
- Rambus Inc.
- David Secker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISTRIBUTED ON-CHIP DECOUPLING APPARATUS AND METHOD USING PACKAGE I...
- Publication number 20170098595
- Publication date Apr 6, 2017
- RAMBUS INC.
- David Secker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED ON-CHIP DECOUPLING APPARATUS AND METHOD USING PACKAGE I...
- Publication number 20150221589
- Publication date Aug 6, 2015
- RAMBUS INC.
- David Secker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED ON-CHIP DECOUPLING APPARATUS AND METHOD USING PACKAGE I...
- Publication number 20130320560
- Publication date Dec 5, 2013
- RAMBUS INC.
- David Secker
- H01 - BASIC ELECTRIC ELEMENTS