Ying Rui

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Physical vapor deposition with isotropic neutral and non-isotropic...
- Patent number 10,648,074
- Issue date May 12, 2020
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition system with a source of isotropic ion vel...
- Patent number 10,400,328
- Issue date Sep 3, 2019
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition method with a source of isotropic ion vel...
- Patent number 9,856,558
- Issue date Jan 2, 2018
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition chamber with capacitive tuning at wafer s...
- Patent number 9,593,411
- Issue date Mar 14, 2017
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing metal in high aspect ratio features
- Patent number 8,563,428
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Karl Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for removing polymer from the wafer backside a...
- Patent number 8,329,593
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Imad Yousif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic confinement of a plasma
- Patent number 8,092,605
- Issue date Jan 10, 2012
- Applied Materials, Inc.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical vapor deposition reactor with circularly symmetric RF feed...
- Patent number 8,070,925
- Issue date Dec 6, 2011
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density plasma gapfill deposition-etch-deposition process etchant
- Patent number 7,972,968
- Issue date Jul 5, 2011
- Applied Materials, Inc.
- Young S. Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for wafer backside polymer removal and wafer front side pho...
- Patent number 7,967,996
- Issue date Jun 28, 2011
- Applied Materials, Inc.
- Kenneth S. Collins
- B08 - CLEANING
Information Patent Grant
Apparatus and method for front side protection during backside clea...
- Patent number 7,879,183
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Imad Yousif
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for removal of metallic residue after plasma etching of a me...
- Patent number 7,320,942
- Issue date Jan 22, 2008
- Applied Materials, Inc.
- Xiaoyi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHYSICAL VAPOR DEPOSITION WITH ISOTROPIC NEUTRAL AND NON-ISOTROPIC...
- Publication number 20190338411
- Publication date Nov 7, 2019
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Physical Vapor Deposition System with a Source of Isotropic Ion Vel...
- Publication number 20180119272
- Publication date May 3, 2018
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION CHAMBER WITH CAPACITIVE TUNING AT WAFER S...
- Publication number 20130008778
- Publication date Jan 10, 2013
- Applied Materials, Inc.
- DANIEL J. HOFFMAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES
- Publication number 20120149192
- Publication date Jun 14, 2012
- Applied Materials, Inc.
- KARL BROWN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...
- Publication number 20110120505
- Publication date May 26, 2011
- Applied Materials, Inc.
- IMAD YOUSIF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ionized Physical Vapor Deposition for Microstructure Controlled Thi...
- Publication number 20100314245
- Publication date Dec 16, 2010
- Applied Materials, Inc.
- Karl Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ionized Physical Vapor Deposition for Microstructure Controlled Thi...
- Publication number 20100314244
- Publication date Dec 16, 2010
- Applied Materials, Inc.
- Karl Brown
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHYSICAL VAPOR DEPOSITION REACTOR WITH CIRCULARLY SYMMETRIC RF FEED...
- Publication number 20100096261
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- DANIEL J. HOFFMAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH DENSITY PLASMA GAPFILL DEPOSITION-ETCH-DEPOSITION PROCESS USIN...
- Publication number 20100041207
- Publication date Feb 18, 2010
- Applied Materials, Inc.
- Young S. Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF SUBSTRATE POLYMER REMOVAL
- Publication number 20090293907
- Publication date Dec 3, 2009
- Nancy Fung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE
- Publication number 20090277874
- Publication date Nov 12, 2009
- Applied Materials, Inc.
- Ying Rui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Physical vapor deposition method with a source of isotropic ion vel...
- Publication number 20090229969
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Daniel J. Hoffman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...
- Publication number 20090214798
- Publication date Aug 27, 2009
- IMAD YOUSIF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK OPEN PROCESS WITH ENHANCED CD SPACE SHRINK AND REDUCTION
- Publication number 20090191711
- Publication date Jul 30, 2009
- Ying Rui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method and apparatus for removing polymer from the wafer backside a...
- Publication number 20090156013
- Publication date Jun 18, 2009
- Imad Yousif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for wafer backside polymer removal and wafer front side pho...
- Publication number 20080179291
- Publication date Jul 31, 2008
- Kenneth S. Collins
- B08 - CLEANING
Information Patent Application
MAGNETIC CONFINEMENT OF A PLASMA
- Publication number 20080121345
- Publication date May 29, 2008
- Applied Materials, Inc.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removal of residue from a substrate
- Publication number 20040237997
- Publication date Dec 2, 2004
- APPLIED MATERIALS, INC.
- Ying Rui
- B08 - CLEANING
Information Patent Application
Method for etching an aluminum layer using an amorphous carbon mask
- Publication number 20040229470
- Publication date Nov 18, 2004
- APPLIED MATERIALS, INC.
- Ying Rui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removal of metallic residue after plasma etching of a me...
- Publication number 20030219912
- Publication date Nov 27, 2003
- Xiaoyi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Physical vapor deposition with isotropic neutral and non-isotropic...

Physical vapor deposition system with a source of isotropic ion vel...

Physical vapor deposition method with a source of isotropic ion vel...

Physical vapor deposition chamber with capacitive tuning at wafer s...

Methods for depositing metal in high aspect ratio features

Method and apparatus for removing polymer from the wafer backside a...

Magnetic confinement of a plasma

Physical vapor deposition reactor with circularly symmetric RF feed...

High density plasma gapfill deposition-etch-deposition process etchant

Process for wafer backside polymer removal and wafer front side pho...

Apparatus and method for front side protection during backside clea...

Method for removal of metallic residue after plasma etching of a me...

Patents Applicationslast 30 patents

PHYSICAL VAPOR DEPOSITION WITH ISOTROPIC NEUTRAL AND NON-ISOTROPIC...

Physical Vapor Deposition System with a Source of Isotropic Ion Vel...

PHYSICAL VAPOR DEPOSITION CHAMBER WITH CAPACITIVE TUNING AT WAFER S...

METHODS FOR DEPOSITING METAL IN HIGH ASPECT RATIO FEATURES

APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...

Ionized Physical Vapor Deposition for Microstructure Controlled Thi...

Ionized Physical Vapor Deposition for Microstructure Controlled Thi...

PHYSICAL VAPOR DEPOSITION REACTOR WITH CIRCULARLY SYMMETRIC RF FEED...

HIGH DENSITY PLASMA GAPFILL DEPOSITION-ETCH-DEPOSITION PROCESS USIN...

METHOD OF SUBSTRATE POLYMER REMOVAL

METHOD AND APPARATUS FOR REMOVING POLYMER FROM A SUBSTRATE

Physical vapor deposition method with a source of isotropic ion vel...

APPARATUS AND METHOD FOR FRONT SIDE PROTECTION DURING BACKSIDE CLEA...

HARDMASK OPEN PROCESS WITH ENHANCED CD SPACE SHRINK AND REDUCTION

Method and apparatus for removing polymer from the wafer backside a...

Process for wafer backside polymer removal and wafer front side pho...

MAGNETIC CONFINEMENT OF A PLASMA

Method for removal of residue from a substrate

Method for etching an aluminum layer using an amorphous carbon mask

Method for removal of metallic residue after plasma etching of a me...