YING SU

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Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Using woven fibers to increase tensile strength and for securing at...
- Patent number 11,518,138
- Issue date Dec 6, 2022
- Apple Inc.
- Edward Siahaan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Woven materials and methods of forming woven materials
- Patent number 10,227,721
- Issue date Mar 12, 2019
- Apple Inc.
- Motohide Hatanaka
- D03 - WEAVING
Information Patent Grant
Self-closing buckle mechanism
- Patent number 10,021,945
- Issue date Jul 17, 2018
- Apple Inc.
- Matthew D. Rohrbach
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Woven band with different stretch regions
- Patent number 9,938,646
- Issue date Apr 10, 2018
- Apple Inc.
- Yoji Hamada
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Woven materials having tapered portions
- Patent number 9,745,676
- Issue date Aug 29, 2017
- Apple Inc.
- Motohide Hatanaka
- D03 - WEAVING
Information Patent Grant
Method for manufacturing multilayer printed circuit boards
- Patent number 8,112,880
- Issue date Feb 14, 2012
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Hu-Hai Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retaining apparatus for a flexible printed circuit board
- Patent number 8,009,432
- Issue date Aug 30, 2011
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ying Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting PCBS
- Patent number 7,943,490
- Issue date May 17, 2011
- FuKui Precision Compenent(Shenzhen) Co., Ltd.
- Ying Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible printed circuit board
- Patent number 7,789,989
- Issue date Sep 7, 2010
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Lin Ren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WOVEN MATERIALS HAVING TAPERED PORTIONS
- Publication number 20160258085
- Publication date Sep 8, 2016
- Apple Inc.
- Motohide Hatanaka
- D03 - WEAVING
Information Patent Application
WOVEN MATERIALS AND METHODS OF FORMING WOVEN MATERIALS
- Publication number 20160258084
- Publication date Sep 8, 2016
- Apple Inc.
- Motohide Hatanaka
- D03 - WEAVING
Information Patent Application
WOVEN BAND WITH DIFFERENT STRETCH REGIONS
- Publication number 20160255921
- Publication date Sep 8, 2016
- Apple Inc.
- Yoji Hamada
- D03 - WEAVING
Information Patent Application
SELF-CLOSING BUCKLE MECHANISM
- Publication number 20160037866
- Publication date Feb 11, 2016
- Apple Inc.
- Matthew D. Rohrbach
- A41 - WEARING APPAREL
Information Patent Application
USING WOVEN FIBERS TO INCREASE TENSILE STRENGTH AND FOR SECURING AT...
- Publication number 20150174854
- Publication date Jun 25, 2015
- Apple Inc.
- Edward Siahaan
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS
- Publication number 20090229121
- Publication date Sep 17, 2009
- FuKui Precision Component (Shenzhen) Co. Ltd.
- Hu-Hai Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20090183823
- Publication date Jul 23, 2009
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- LIN REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CUTTING PCBS
- Publication number 20090042370
- Publication date Feb 12, 2009
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- YING SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING SUPPORT FOR A FLEXIBLE PRINTED CIRCUIT BOARD AND RETAINING...
- Publication number 20080266819
- Publication date Oct 30, 2008
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- YING SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Using woven fibers to increase tensile strength and for securing at...

Woven materials and methods of forming woven materials

Self-closing buckle mechanism

Woven band with different stretch regions

Woven materials having tapered portions

Method for manufacturing multilayer printed circuit boards

Retaining apparatus for a flexible printed circuit board

Method of cutting PCBS

Method for manufacturing rigid-flexible printed circuit board

Patents Applicationslast 30 patents

WOVEN MATERIALS HAVING TAPERED PORTIONS

WOVEN MATERIALS AND METHODS OF FORMING WOVEN MATERIALS

WOVEN BAND WITH DIFFERENT STRETCH REGIONS

SELF-CLOSING BUCKLE MECHANISM

USING WOVEN FIBERS TO INCREASE TENSILE STRENGTH AND FOR SECURING AT...

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS

METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

METHOD OF CUTTING PCBS

MOUNTING SUPPORT FOR A FLEXIBLE PRINTED CIRCUIT BOARD AND RETAINING...