Ying Trickett

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Albany, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 12,237,216
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform and method of operating for integrated end-to-end CMP-less...
- Patent number 10,861,744
- Issue date Dec 8, 2020
- Tokyo Electron Limited
- Ying Trickett
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of corner rounding and trimming of nanowires by microwave pl...
- Patent number 10,008,564
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF VIA FILLING
- Publication number 20250105059
- Publication date Mar 27, 2025
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR TRANSISTOR STRUCTURES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240405022
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING RECESSED FEATURES IN SEMICONDUCTOR DEVICES WITH...
- Publication number 20220301930
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORM AND METHOD OF OPERATING FOR INTEGRATED END-TO-END CMP-LESS...
- Publication number 20190295887
- Publication date Sep 26, 2019
- TOKYO ELECTRON LIMITED
- Ying Trickett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORNER ROUNDING AND TRIMMING OF NANOWIRES BY MICROWAVE PL...
- Publication number 20170125517
- Publication date May 4, 2017
- TOKYO ELECTRON LIMITED
- Kandabara N. Tapily
- H01 - BASIC ELECTRIC ELEMENTS