Ying-Tsung Chu

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure
- Patent number 11,837,564
- Issue date Dec 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure
- Patent number 11,335,691
- Issue date May 17, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Ying-Tsung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure and manufacturing method thereof
- Patent number 10,971,501
- Issue date Apr 6, 2021
- Powerchip Semiconductor Manufacturing Corporation
- Ying-Tsung Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230034412
- Publication date Feb 2, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor bonding structure
- Publication number 20230018214
- Publication date Jan 19, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE
- Publication number 20210175237
- Publication date Jun 10, 2021
- Powerchip Semiconductor Manufacturing Corporation
- Ying-Tsung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200328215
- Publication date Oct 15, 2020
- Powerchip Semiconductor Manufacturing Corporation
- Ying-Tsung Chu
- H01 - BASIC ELECTRIC ELEMENTS