Ying Wang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit package supports
- Patent number 11,830,809
- Issue date Nov 28, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,721,677
- Issue date Aug 8, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for package substrates
- Patent number 11,705,389
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors
- Patent number 11,651,885
- Issue date May 16, 2023
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 11,646,254
- Issue date May 9, 2023
- Tahoe Research, LTD.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,557,579
- Issue date Jan 17, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric cored integrated circuit package supports
- Patent number 11,552,008
- Issue date Jan 10, 2023
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit packages
- Patent number 11,444,042
- Issue date Sep 13, 2022
- Intel Corporation
- Andrew James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a first level interface
- Patent number 11,322,290
- Issue date May 3, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,246,218
- Issue date Feb 8, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a second level interface
- Patent number 11,031,360
- Issue date Jun 8, 2021
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 10,804,188
- Issue date Oct 13, 2020
- Intel Corporation
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate with through-hole magnetic core ind...
- Patent number 10,790,159
- Issue date Sep 29, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a second level interface
- Patent number 10,777,514
- Issue date Sep 15, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D conductive ink printing method and inductor formed thereof
- Patent number 10,692,965
- Issue date Jun 23, 2020
- Intel Corporation
- Chong Zhang
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20240405006
- Publication date Dec 5, 2024
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20230352385
- Publication date Nov 2, 2023
- Tahoe Research, Ltd.
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20230238368
- Publication date Jul 27, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR ON A GLASS SUBSTRATE
- Publication number 20230197351
- Publication date Jun 22, 2023
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20230187205
- Publication date Jun 15, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20220230800
- Publication date Jul 21, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
- Publication number 20220117089
- Publication date Apr 14, 2022
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20210305154
- Publication date Sep 30, 2021
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20210111166
- Publication date Apr 15, 2021
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20210020558
- Publication date Jan 21, 2021
- Intel Corporation
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE
- Publication number 20200411413
- Publication date Dec 31, 2020
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS FOR PACKAGE SUBSTRATES
- Publication number 20200395282
- Publication date Dec 17, 2020
- Intel Corporation
- Andrew J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
- Publication number 20200373257
- Publication date Nov 26, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
- Publication number 20200312738
- Publication date Oct 1, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20200212020
- Publication date Jul 2, 2020
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS
- Publication number 20200168384
- Publication date May 28, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200168536
- Publication date May 28, 2020
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
- Publication number 20200118990
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING
- Publication number 20200119250
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CONDUCTIVE INK PRINTING METHOD AND INDUCTOR FORMED THEREOF
- Publication number 20200098848
- Publication date Mar 26, 2020
- Chong Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20200083153
- Publication date Mar 12, 2020
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20200027728
- Publication date Jan 23, 2020
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20190385780
- Publication date Dec 19, 2019
- Intel Corporation
- Cheng Xu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
- Publication number 20190385959
- Publication date Dec 19, 2019
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20190371744
- Publication date Dec 5, 2019
- Intel Corporation
- Andrew James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF H...
- Publication number 20190295937
- Publication date Sep 26, 2019
- Intel Corporation
- Chong ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Microelectronic assemblies having an integrated capacitor

Vented lids for integrated circuit packages

Magnetic structures in integrated circuit package supports

Microelectronic assemblies having an integrated capacitor

Vias for package substrates

Core layer with fully encapsulated co-axial magnetic material aroun...

Magnetic core inductors

Electronic device including a lateral trace

Microelectronic assemblies having an integrated capacitor

Asymmetric cored integrated circuit package supports

Microelectronic assemblies having a cooling channel

Thermal management solutions for integrated circuit packages

Magnetic structures in integrated circuit packages

Phase change material in substrate cavity

Magnetic inductor structures for package devices

Techniques for an inductor at a first level interface

Core layer with fully encapsulated co-axial magnetic material aroun...

Techniques for an inductor at a second level interface

Electronic device including a lateral trace

Semiconductor package substrate with through-hole magnetic core ind...

Techniques for an inductor at a second level interface

3D conductive ink printing method and inductor formed thereof

Patents Applicationslast 30 patents

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

FILM CAPACITOR ON A GLASS SUBSTRATE

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

SUBSTRATE FOR AN ELECTRONIC DEVICE

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

VIAS FOR PACKAGE SUBSTRATES

TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE

THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

MAGNETIC CORE INDUCTORS

ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS

PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY

IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING

3D CONDUCTIVE INK PRINTING METHOD AND INDUCTOR FORMED THEREOF

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE

MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGES

NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF H...