Ying-Wei Jiang

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Tianjin, CN

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Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND AND METHOD OF FORMING SAME
- Publication number 20080116548
- Publication date May 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR