Ying Ying Lim

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,569,146
- Issue date Jan 31, 2023
- Agency for Science, Technology and Research
- Ka Fai Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Inter Wallet Transactions
- Publication number 20220027895
- Publication date Jan 27, 2022
- VISA INTERNATIONAL SERVICE ASSOCIATION
- Yuanbo Zhu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20200185299
- Publication date Jun 11, 2020
- Agency for Science, Technology and Research
- Ka Fai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and a Method of Forming the Same
- Publication number 20130001795
- Publication date Jan 3, 2013
- Agency For Science, Technology and Research
- Teck Guan LIM
- H01 - BASIC ELECTRIC ELEMENTS