Ying Yu

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Scaling for split-networking datapath
- Patent number 12,192,051
- Issue date Jan 7, 2025
- VMWARE LLC
- Yong Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Scaling of logical router pods
- Patent number 12,021,682
- Issue date Jun 25, 2024
- VMWARE LLC
- Abhishek Goliya
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Edge node with datapath split between pods
- Patent number 11,838,206
- Issue date Dec 5, 2023
- VMware, Inc.
- Yong Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multicast packet handling based on flow cache information
- Patent number 11,570,011
- Issue date Jan 31, 2023
- VMware, Inc.
- Dexiang Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer scrubbing device having brush assembly and mounting assembly...
- Patent number 6,820,298
- Issue date Nov 23, 2004
- Applied Materials, Inc.
- John M White
- B08 - CLEANING
Information Patent Grant
Plasma enhanced CVD low k carbon-doped silicon oxide film depositio...
- Patent number 6,797,643
- Issue date Sep 28, 2004
- Applied Materials Inc.
- Juan Carlos Rocha-Alvarez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a silicon nitride layer on a substrate
- Patent number 6,645,884
- Issue date Nov 11, 2003
- Applied Materials, Inc.
- Michael X. Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for directing constituents through a processin...
- Patent number 6,586,343
- Issue date Jul 1, 2003
- Applied Materials, Inc.
- Henry Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for aligning a wafer
- Patent number 6,436,192
- Issue date Aug 20, 2002
- Applied Materials, Inc.
- Ling Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for aligning a wafer
- Patent number 6,063,440
- Issue date May 16, 2000
- Applied Materials, Inc.
- Ling Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
EDGE NODE WITH DATAPATH SPLIT BETWEEN PODS
- Publication number 20230028922
- Publication date Jan 26, 2023
- VMware, Inc.
- Yong Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SCALING FOR SPLIT-NETWORKING DATAPATH
- Publication number 20230028837
- Publication date Jan 26, 2023
- VMware, Inc.
- Yong Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTICAST PACKET HANDLING BASED ON FLOW CACHE INFORMATION
- Publication number 20220217006
- Publication date Jul 7, 2022
- VMware, Inc.
- Dexiang WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REACTOR TO FORM SOLAR CELL ABSORBERS
- Publication number 20090183675
- Publication date Jul 23, 2009
- Mustafa Pinarbasi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
REEL-TO-REEL REACTION OF A PRECURSOR FILM TO FORM SOLAR CELL ABSORBER
- Publication number 20080175993
- Publication date Jul 24, 2008
- Jalal Ashjaee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ENHANCED CVD LOW K CARBON-DOPED SILICON OXIDE FILM DEPOSITIO...
- Publication number 20040082193
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- Juan Carlos Rocha-Alvarez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer scrubbing device having brush assembly and mounting assembly...
- Publication number 20020152567
- Publication date Oct 24, 2002
- APPLIED MATERIALS, INC.
- John M. White
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a silicon nitride layer on a semiconductor wafer
- Publication number 20020045362
- Publication date Apr 18, 2002
- Michael X. Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus And Method For Aligning A Wafer
- Publication number 20010037771
- Publication date Nov 8, 2001
- Ling Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Scaling for split-networking datapath

Scaling of logical router pods

Edge node with datapath split between pods

Multicast packet handling based on flow cache information

Wafer scrubbing device having brush assembly and mounting assembly...

Plasma enhanced CVD low k carbon-doped silicon oxide film depositio...

Method of forming a silicon nitride layer on a substrate

Method and apparatus for directing constituents through a processin...

Apparatus for aligning a wafer

Method for aligning a wafer

Patents Applicationslast 30 patents

EDGE NODE WITH DATAPATH SPLIT BETWEEN PODS

SCALING FOR SPLIT-NETWORKING DATAPATH

MULTICAST PACKET HANDLING BASED ON FLOW CACHE INFORMATION

REACTOR TO FORM SOLAR CELL ABSORBERS

REEL-TO-REEL REACTION OF A PRECURSOR FILM TO FORM SOLAR CELL ABSORBER

PLASMA ENHANCED CVD LOW K CARBON-DOPED SILICON OXIDE FILM DEPOSITIO...

Wafer scrubbing device having brush assembly and mounting assembly...

Method of forming a silicon nitride layer on a semiconductor wafer

Apparatus And Method For Aligning A Wafer