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Yinghui LI

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  • Tianjin, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stacked die semiconductor package
    • Patent number 8,692,387
    • Issue date Apr 8, 2014
    • FREESCALE SEMICONDUCTOR, INC.
    • Shunan Qiu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    STACKED DIE SEMICONDUCTOR PACKAGE
    • Publication number 20130020690
    • Publication date Jan 24, 2013
    • FREESCALE SEMICONDUCTOR, INC.
    • Shunan QIU
    • H01 - BASIC ELECTRIC ELEMENTS