Yingjiang Pu

Person

Chengdu, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structure and multi-die co-packing method
- Patent number 12,002,787
- Issue date Jun 4, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and integrated circuit package...
- Patent number 11,824,001
- Issue date Nov 21, 2023
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel level metal wall grids array for integrated circuit packaging
- Patent number 11,670,600
- Issue date Jun 6, 2023
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure, integrated circuit package un...
- Patent number 11,616,017
- Issue date Mar 28, 2023
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321711
- Publication date Sep 26, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD
- Publication number 20220344175
- Publication date Oct 27, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD
- Publication number 20220344231
- Publication date Oct 27, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE CO-PACKED MODULE AND MULTI-DIE CO-PACKING METHOD
- Publication number 20220208732
- Publication date Jun 30, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD
- Publication number 20220208731
- Publication date Jun 30, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...
- Publication number 20220208714
- Publication date Jun 30, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD
- Publication number 20220199581
- Publication date Jun 23, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...
- Publication number 20220077053
- Publication date Mar 10, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...
- Publication number 20220077054
- Publication date Mar 10, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL METAL WALL GRIDS ARRAY FOR INTEGRATED CIRCUIT PACKAGING...
- Publication number 20220077075
- Publication date Mar 10, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS

Yingjiang Pu

Person

Patents Grantslast 30 patents

Flip chip package unit comprising thermal protection film and assoc...

Multi-die package structure and multi-die co-packing method

Integrated circuit package structure and integrated circuit package...

Panel level metal wall grids array for integrated circuit packaging

Integrated circuit package structure, integrated circuit package un...

Patents Applicationslast 30 patents

SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME

FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD

FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD

MULTI-DIE CO-PACKED MODULE AND MULTI-DIE CO-PACKING METHOD

MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD

INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...

MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD

INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...

INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...

PANEL LEVEL METAL WALL GRIDS ARRAY FOR INTEGRATED CIRCUIT PACKAGING...