Yinglei Ren

Follow

Person

Shanghai, CN

People

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
- Publication number 20240260228
- Publication date Aug 1, 2024
- Intel Corporation
- Jimmy Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR