Yingqiang YAN

Person

Guangzhou, Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Filter radio frequency module packaging structure and method for ma...
- Patent number 12,184,253
- Issue date Dec 31, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang Yan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaging method and package structure for filter chip
- Patent number 11,784,625
- Issue date Oct 10, 2023
- GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
- Yingqiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging method and fan-out packaging plate
- Patent number 11,710,646
- Issue date Jul 25, 2023
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20240283132
- Publication date Aug 22, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240234328
- Publication date Jul 11, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...
- Publication number 20240186254
- Publication date Jun 6, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240136297
- Publication date Apr 25, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...
- Publication number 20240007072
- Publication date Jan 4, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yingqiang YAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20230253333
- Publication date Aug 10, 2023
- GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT TYPE PACKAGE PREPARATION METHOD OF FAN-OUT TYPE PACKAGE
- Publication number 20230245944
- Publication date Aug 3, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20220149007
- Publication date May 12, 2022
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yuan BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out Packaging Method and Fan-out Packaging Plate
- Publication number 20220051908
- Publication date Feb 17, 2022
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS
- Publication number 20210358883
- Publication date Nov 18, 2021
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR FILTER CHIP
- Publication number 20210184649
- Publication date Jun 17, 2021
- Yingqiang YAN
- H03 - BASIC ELECTRONIC CIRCUITRY

Yingqiang YAN

Person

Patents Grantslast 30 patents

Filter radio frequency module packaging structure and method for ma...

Packaging method and package structure for filter chip

Fan-out packaging method and fan-out packaging plate

Patents Applicationslast 30 patents

FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...

CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD T...

FAN-OUT TYPE PACKAGE PREPARATION METHOD OF FAN-OUT TYPE PACKAGE

CHIP PACKAGING STRUCTURE AND METHOD

Fan-out Packaging Method and Fan-out Packaging Plate

FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS

PACKAGING METHOD AND PACKAGE STRUCTURE FOR FILTER CHIP