YINLUNG LU

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,313,675
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Through-circuit Vias in interconnect structures
- Patent number 12,293,959
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,270,852
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 12,243,805
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,066,484
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,025,655
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,830,832
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,754,621
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for wafer-level testing
- Patent number 11,630,149
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 11,616,002
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,448,692
- Issue date Sep 20, 2022
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for manufacturing a semiconductor device
- Patent number 11,361,141
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsuan-Ming Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure
- Patent number 11,309,258
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 11,073,551
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,957,664
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor device
- Patent number 10,726,191
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsuan-Ming Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,707,179
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF
- Publication number 20250157887
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENDRITE MITIGATION OF PASSIVE COMPONENTS
- Publication number 20250038043
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20240387331
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20240361380
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20240310434
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20240312857
- Publication date Sep 19, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
- Publication number 20240071998
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20240047321
- Publication date Feb 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure with Stress Buffer Zone and Method of Forming Same
- Publication number 20240006352
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- SyuFong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE-CLAD METAL INTERCONNECT
- Publication number 20230402385
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20230386973
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20230366925
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20230251306
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20220367323
- Publication date Nov 17, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20220326300
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20220300695
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HSUAN-MING HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Through-Circuit Vias in Interconnect Structures
- Publication number 20210375723
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20210311110
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210447
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20210199710
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Package component

Method and device for wafer-level testing

Through-circuit Vias in interconnect structures

Method and system for wafer-level testing

Through-circuit vias in interconnect structures

Method and device for wafer-level testing

Method and system for wafer-level testing

Package component and forming method thereof

Semiconductor structure and manufacturing method thereof

Method and device for wafer-level testing

Method and system for wafer-level testing

Through-circuit vias in interconnect structures

Method and device for wafer-level testing

Method and system for manufacturing a semiconductor device

Semiconductor structure

Method and system for wafer-level testing

Semiconductor structure and manufacturing method thereof

Method and system for manufacturing a semiconductor device

Semiconductor structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF

DENDRITE MITIGATION OF PASSIVE COMPONENTS

Through-Circuit Vias In Interconnect Structures

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME

PACKAGE COMPONENT

INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

Bonding Structure with Stress Buffer Zone and Method of Forming Same

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

GRAPHENE-CLAD METAL INTERCONNECT

GRAPHENE-METAL HYBRID INTERCONNECT

Through-Circuit Vias In Interconnect Structures

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

PACKAGE COMPONENT AND FORMING METHOD THEREOF

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

Through-Circuit Vias In Interconnect Structures

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Through-Circuit Vias in Interconnect Structures

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND DEVICE FOR WAFER-LEVEL TESTING