Yinon Degani

Person

Middlesex, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
RF devices
- Patent number 8,102,021
- Issue date Jan 24, 2012
- Sychip Inc.
- Yinon Degani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip-bonded dual-substrate inductor, flip-bonded dual-substrate ind...
- Patent number 8,018,027
- Issue date Sep 13, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuo Rao Bizen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device substrates
- Patent number 7,936,043
- Issue date May 3, 2011
- Sychip Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding noisy conductors in integrated passive devices
- Patent number 7,795,709
- Issue date Sep 14, 2010
- Sychip Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact balun transformers
- Patent number 7,692,511
- Issue date Apr 6, 2010
- Sychip Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive devices
- Patent number 7,382,056
- Issue date Jun 3, 2008
- Sychip Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive devices with high Q inductors
- Patent number 7,355,264
- Issue date Apr 8, 2008
- Sychip Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive devices
- Patent number 7,259,077
- Issue date Aug 21, 2007
- Sychip Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SDIO memory and interface card
- Patent number 7,170,754
- Issue date Jan 30, 2007
- Sychip Inc.
- Moses Asom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Testing integrated circuits
- Patent number 7,061,258
- Issue date Jun 13, 2006
- Sychip Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Membrane test method and apparatus for integrated circuit testing
- Patent number 6,867,607
- Issue date Mar 15, 2005
- Sychip, Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Stacked module package
- Patent number 6,734,539
- Issue date May 11, 2004
- Lucent Technologies Inc.
- Yinon Degani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of testing and constructing monolithic multi-chip modules
- Patent number 6,680,212
- Issue date Jan 20, 2004
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance multi-chip IC package
- Patent number 6,678,167
- Issue date Jan 13, 2004
- Agere Systems Inc.
- Yinon Degani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip metallization
- Patent number 6,597,069
- Issue date Jul 22, 2003
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for testing integrated circuits
- Patent number 6,560,735
- Issue date May 6, 2003
- Agere Systems Inc.
- Louis Nelson Ahlquist
- G01 - MEASURING TESTING
Information Patent Grant
Multi-chip ball grid array IC packages
- Patent number 6,437,990
- Issue date Aug 20, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging micromechanical devices
- Patent number 6,433,411
- Issue date Aug 13, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnecting micromechanical devices
- Patent number 6,396,711
- Issue date May 28, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacture of printed circuit cards
- Patent number 6,370,766
- Issue date Apr 16, 2002
- Lucent Technologies Inc.
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Grant
Packaging silicon on silicon multichip modules
- Patent number 6,369,444
- Issue date Apr 9, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing integrated circuits
- Patent number 6,342,399
- Issue date Jan 29, 2002
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost ball grid array package
- Patent number 6,282,100
- Issue date Aug 28, 2001
- Agere Systems Guardian Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit packages
- Patent number 6,251,705
- Issue date Jun 26, 2001
- Agere Systems Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bump bonding
- Patent number 6,232,212
- Issue date May 15, 2001
- Lucent Technologies
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for recessed flip-chip package
- Patent number 6,175,158
- Issue date Jan 16, 2001
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Translator for recessed flip-chip package
- Patent number 6,160,715
- Issue date Dec 12, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed flip-chip package
- Patent number 6,154,370
- Issue date Nov 28, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip metallization
- Patent number 6,130,141
- Issue date Oct 10, 2000
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bonding printed circuit boards
- Patent number 6,100,475
- Issue date Aug 8, 2000
- Lucent Technologies, Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A FLIP-BONDED DUAL-SUBSTRATE INDUCTOR, FLIP-...
- Publication number 20110101497
- Publication date May 5, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuo BIZEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF devices
- Publication number 20090278690
- Publication date Nov 12, 2009
- Yinon Degani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Compact balun transformers
- Publication number 20090237175
- Publication date Sep 24, 2009
- Yinon Degani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated passive devices
- Publication number 20090218655
- Publication date Sep 3, 2009
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM packages
- Publication number 20090184416
- Publication date Jul 23, 2009
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding noisy conductors in integrated passive devices
- Publication number 20080061405
- Publication date Mar 13, 2008
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES WITH HIGH Q INDUCTORS
- Publication number 20080061420
- Publication date Mar 13, 2008
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated passive devices
- Publication number 20070262418
- Publication date Nov 15, 2007
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated passive device substrates
- Publication number 20070215976
- Publication date Sep 20, 2007
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated passive devices
- Publication number 20070065964
- Publication date Mar 22, 2007
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding noisy conductors in integrated passive devices
- Publication number 20060255434
- Publication date Nov 16, 2006
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cellular/Wi-Fi combination devices
- Publication number 20060217102
- Publication date Sep 28, 2006
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency integrated circuits
- Publication number 20060197182
- Publication date Sep 7, 2006
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density flip chip interconnections
- Publication number 20050277226
- Publication date Dec 15, 2005
- Yinon Degani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated passive devices
- Publication number 20050253255
- Publication date Nov 17, 2005
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated passive devices
- Publication number 20050253257
- Publication date Nov 17, 2005
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SDIO memory and interface card
- Publication number 20050248926
- Publication date Nov 10, 2005
- Moses Asom
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Testing integrated circuits
- Publication number 20050088194
- Publication date Apr 28, 2005
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Application
High frequency integrated circuits
- Publication number 20040075170
- Publication date Apr 22, 2004
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing integrated circuits
- Publication number 20030137315
- Publication date Jul 24, 2003
- Yinon Degani
- G01 - MEASURING TESTING
Information Patent Application
Stacked module package
- Publication number 20020079568
- Publication date Jun 27, 2002
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of testing and constructing monolithic multi-chip modules
- Publication number 20020081755
- Publication date Jun 27, 2002
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing integrated circuits
- Publication number 20020075031
- Publication date Jun 20, 2002
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS

Yinon Degani

Person

Patents Grantslast 30 patents

RF devices

Flip-bonded dual-substrate inductor, flip-bonded dual-substrate ind...

Integrated passive device substrates

Shielding noisy conductors in integrated passive devices

Compact balun transformers

Integrated passive devices

Integrated passive devices with high Q inductors

Integrated passive devices

SDIO memory and interface card

Testing integrated circuits

Membrane test method and apparatus for integrated circuit testing

Stacked module package

Method of testing and constructing monolithic multi-chip modules

High performance multi-chip IC package

Flip chip metallization

Methods and apparatus for testing integrated circuits

Multi-chip ball grid array IC packages

Packaging micromechanical devices

Interconnecting micromechanical devices

Manufacture of printed circuit cards

Packaging silicon on silicon multichip modules

Testing integrated circuits

Low cost ball grid array package

Low profile integrated circuit packages

Flip chip bump bonding

Interposer for recessed flip-chip package

Translator for recessed flip-chip package

Recessed flip-chip package

Flip chip metallization

Solder bonding printed circuit boards

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A FLIP-BONDED DUAL-SUBSTRATE INDUCTOR, FLIP-...

RF devices

Compact balun transformers

Integrated passive devices

MCM packages

Shielding noisy conductors in integrated passive devices

INTEGRATED PASSIVE DEVICES WITH HIGH Q INDUCTORS

Integrated passive devices

Integrated passive device substrates

Integrated passive devices

Shielding noisy conductors in integrated passive devices

Cellular/Wi-Fi combination devices

High frequency integrated circuits

High density flip chip interconnections

Integrated passive devices

Integrated passive devices

SDIO memory and interface card

Testing integrated circuits

High frequency integrated circuits

Testing integrated circuits

Stacked module package

Method of testing and constructing monolithic multi-chip modules

Testing integrated circuits