Yip Chee Sang

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Perak, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method for encapsulating lead frame packages
- Patent number 7,214,562
- Issue date May 8, 2007
- Carsem (M) Sdn. Bhd.
- Richard Yee Mow Lum
- H01 - BASIC ELECTRIC ELEMENTS