Yiping Feng

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for determining dielectric layer properties
- Patent number 8,004,290
- Issue date Aug 23, 2011
- KLA-Tencor Corporation
- Xiafang Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for controlling deposition of a charge on a waf...
- Patent number 7,893,703
- Issue date Feb 22, 2011
- KLA-Tencor Technologies Corp.
- Jeffrey A. Rzepiela
- G01 - MEASURING TESTING
Information Patent Grant
Measurement of effective capacitance
- Patent number 7,525,304
- Issue date Apr 28, 2009
- KLA-Tencor Corporation
- Yiping Feng
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Test Pads, Methods and Systems for Measuring Properties of a Wafer
- Publication number 20070109003
- Publication date May 17, 2007
- KLA-TENCOR TECHNOLOGIES CORP.
- Jianou Shi
- G01 - MEASURING TESTING
Information Patent Application
Systems and Methods for Controlling Deposition of a Charge on a Waf...
- Publication number 20070069759
- Publication date Mar 29, 2007
- KLA-TENCOR TECHNOLOGIES CORP.
- Jeffrey A. Rzepiela
- G01 - MEASURING TESTING