Yiping Wang

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,972,978
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,844,220
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an apparatus including laminate spacer structures
- Patent number 11,729,964
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including staircase structure having conductive pads
- Patent number 11,721,629
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,700,729
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Yi Hu
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,621,273
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive levels having varying...
- Patent number 11,594,495
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
- Patent number 11,355,392
- Issue date Jun 7, 2022
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,205,654
- Issue date Dec 21, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including laminate spacer structures, and related memor...
- Patent number 11,164,873
- Issue date Nov 2, 2021
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atom implantation for reduction of compressive stress
- Patent number 11,011,378
- Issue date May 18, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Memory Circuitry And Methods Used In Forming Memory Circuitry
- Publication number 20240349505
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Yiping Wang
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240113012
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DOPED TRENCHES FOR MEMORY
- Publication number 20240105510
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071919
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mohad Baboli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071905
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Martin J. Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240074201
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240064982
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240047362
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20240021521
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Collin Howder
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20230395513
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING SUPPORT CONTAC...
- Publication number 20230395525
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230345723
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING STAIRCASE STRUCTURE HAVING CONDUCTIVE PADS
- Publication number 20230335500
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...
- Publication number 20230154856
- Publication date May 18, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230104297
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING STAIRCASE STRUCTURE HAVING CONDUCTIVE PADS
- Publication number 20230022792
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...
- Publication number 20220310522
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
Conductive Via Of Integrated Circuitry, Memory Array Comprising Str...
- Publication number 20220262678
- Publication date Aug 18, 2022
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220077169
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Via Of Integrated Circuitry, Memory Array Comprising Str...
- Publication number 20220044965
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES
- Publication number 20220020748
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210358940
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210057428
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOM IMPLANTATION FOR REDUCTION OF COMPRESSIVE STRESS
- Publication number 20210005455
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING LAMINATE SPACER STRUCTURES, AND RELATED MEMOR...
- Publication number 20200373304
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS

Yiping Wang

Person

Patents Grantslast 30 patents

Microelectronic devices and memory devices including conductive lev...

Conductive via of integrated circuitry, memory array comprising str...

Integrated assemblies and methods of forming integrated assemblies

Methods of forming an apparatus including laminate spacer structures

Memory device including staircase structure having conductive pads

Memory arrays and methods used in forming a memory array comprising...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including conductive levels having varying...

Conductive via of integrated circuitry, memory array comprising str...

Memory arrays and methods used in forming a memory array comprising...

Apparatuses including laminate spacer structures, and related memor...

Atom implantation for reduction of compressive stress

Patents Applicationslast 30 patents

Memory Circuitry And Methods Used In Forming Memory Circuitry

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

PLASMA-DOPED TRENCHES FOR MEMORY

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

Memory Circuitry And Method Used In Forming Memory Circuitry

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Circuitry And Method Used In Forming Memory Circuitry

STAIRCASE STRUCTURES FOR ACCESSING THREE-DIMENSIONAL MEMORY ARRAYS

Memory Circuitry And Method Used In Forming Memory Circuitry

METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING SUPPORT CONTAC...

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MEMORY DEVICE INCLUDING STAIRCASE STRUCTURE HAVING CONDUCTIVE PADS

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...

Integrated Assemblies and Methods of Forming Integrated Assemblies

MEMORY DEVICE INCLUDING STAIRCASE STRUCTURE HAVING CONDUCTIVE PADS

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...

Conductive Via Of Integrated Circuitry, Memory Array Comprising Str...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Conductive Via Of Integrated Circuitry, Memory Array Comprising Str...

METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

ATOM IMPLANTATION FOR REDUCTION OF COMPRESSIVE STRESS

APPARATUSES INCLUDING LAMINATE SPACER STRUCTURES, AND RELATED MEMOR...