Yiqun Bai

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity, high modulus structure within a mold mat...
- Patent number 11,749,585
- Issue date Sep 5, 2023
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenches in wafer level packages for improvements in warpage reliab...
- Patent number 11,688,634
- Issue date Jun 27, 2023
- Intel Corporation
- Vipul Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader comprising a silver and sintering silver l...
- Patent number 11,562,940
- Issue date Jan 24, 2023
- Intel Corporation
- Elizabeth Nofen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound with reinforced fibers
- Patent number 9,704,767
- Issue date Jul 11, 2017
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing underfill filler settling in integrated circuit...
- Patent number 9,431,274
- Issue date Aug 30, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy-amine underfill materials for semiconductor packages
- Patent number 8,916,981
- Issue date Dec 23, 2014
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro-channels for 3D through silicon architectures
- Patent number 8,012,808
- Issue date Sep 6, 2011
- Intel Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro-channels for 3D through silicon architectures
- Patent number 7,432,592
- Issue date Oct 7, 2008
- Intel Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE
- Publication number 20240395567
- Publication date Nov 28, 2024
- Intel Corporation
- Jonas G. Croissant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- Publication number 20240222345
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...
- Publication number 20240222243
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219654
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219656
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...
- Publication number 20240222304
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
- Publication number 20240222257
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE FABRICATION USING HYBRID BONDING
- Publication number 20240222210
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...
- Publication number 20240222238
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS
- Publication number 20240213170
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
- Publication number 20240215269
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
- Publication number 20240213116
- Publication date Jun 27, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERM...
- Publication number 20240213164
- Publication date Jun 27, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
- Publication number 20240213169
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186228
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112971
- Publication date Apr 4, 2024
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES
- Publication number 20240071848
- Publication date Feb 29, 2024
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS
- Publication number 20230089928
- Publication date Mar 23, 2023
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20220196937
- Publication date Jun 23, 2022
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
COMPLETELY ENCAPSULATED OPTICAL MULTI CHIP PACKAGE
- Publication number 20220196941
- Publication date Jun 23, 2022
- Intel Corporation
- Asako TODA
- G02 - OPTICS
Information Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
- Publication number 20220102242
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Hydrophobic feature to control adhesive flow

Completely encapsulated optical multi chip package

Dummy die structures of a packaged integrated circuit device

High thermal conductivity, high modulus structure within a mold mat...

Trenches in wafer level packages for improvements in warpage reliab...

Coupled cooling fins in ultra-small systems

Integrated heat spreader comprising a silver and sintering silver l...

Thermal management solutions for integrated circuit packages

Methods of promoting adhesion between underfill and conductive bump...

Mold compound with reinforced fibers

Narrow-gap flip chip underfill composition

Method for reducing underfill filler settling in integrated circuit...

Methods of promoting adhesion between underfill and conductive bump...

Narrow-gap flip chip underfill composition

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Epoxy-amine underfill materials for semiconductor packages

Integrated micro-channels for 3D through silicon architectures

Integrated micro-channels for 3D through silicon architectures

Patents Applicationslast 30 patents

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

2D FILLERS FOR REDUCED CTE FOR PID

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...

ELECTRICAL LAYER WITH ROUGHENED SURFACES

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

GLASS SUBSTRATE FABRICATION USING HYBRID BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...

TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERM...

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES

SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

COMPLETELY ENCAPSULATED OPTICAL MULTI CHIP PACKAGE

DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE