Yiqun Bai

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity, high modulus structure within a mold mat...
- Patent number 11,749,585
- Issue date Sep 5, 2023
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenches in wafer level packages for improvements in warpage reliab...
- Patent number 11,688,634
- Issue date Jun 27, 2023
- Intel Corporation
- Vipul Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader comprising a silver and sintering silver l...
- Patent number 11,562,940
- Issue date Jan 24, 2023
- Intel Corporation
- Elizabeth Nofen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound with reinforced fibers
- Patent number 9,704,767
- Issue date Jul 11, 2017
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing underfill filler settling in integrated circuit...
- Patent number 9,431,274
- Issue date Aug 30, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 9,230,833
- Issue date Jan 5, 2016
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent filler entrapment in microelectronic device to m...
- Patent number 8,999,765
- Issue date Apr 7, 2015
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy-amine underfill materials for semiconductor packages
- Patent number 8,916,981
- Issue date Dec 23, 2014
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro-channels for 3D through silicon architectures
- Patent number 8,012,808
- Issue date Sep 6, 2011
- Intel Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro-channels for 3D through silicon architectures
- Patent number 7,432,592
- Issue date Oct 7, 2008
- Intel Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE
- Publication number 20250110295
- Publication date Apr 3, 2025
- Intel Corporation
- Ziyin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE
- Publication number 20240395567
- Publication date Nov 28, 2024
- Intel Corporation
- Jonas G. Croissant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- Publication number 20240222345
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...
- Publication number 20240222243
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219654
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Hydrophobic feature to control adhesive flow

Completely encapsulated optical multi chip package

Dummy die structures of a packaged integrated circuit device

High thermal conductivity, high modulus structure within a mold mat...

Trenches in wafer level packages for improvements in warpage reliab...

Coupled cooling fins in ultra-small systems

Integrated heat spreader comprising a silver and sintering silver l...

Thermal management solutions for integrated circuit packages

Methods of promoting adhesion between underfill and conductive bump...

Mold compound with reinforced fibers

Narrow-gap flip chip underfill composition

Method for reducing underfill filler settling in integrated circuit...

Methods of promoting adhesion between underfill and conductive bump...

Narrow-gap flip chip underfill composition

Methods to prevent filler entrapment in microelectronic device to m...

Methods to prevent filler entrapment in microelectronic device to m...

Epoxy-amine underfill materials for semiconductor packages

Integrated micro-channels for 3D through silicon architectures

Integrated micro-channels for 3D through silicon architectures

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

2D FILLERS FOR REDUCED CTE FOR PID

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD