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Icheon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of controlling warpage in semicondu...
Patent number
9,406,579
Issue date
Aug 2, 2016
STATS ChipPAC Pte. Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of depositing underfill material wi...
Patent number
9,390,945
Issue date
Jul 12, 2016
STATS ChipPAC Pte. Ltd.
KyungHoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system having warpage prevention struc...
Patent number
8,723,310
Issue date
May 13, 2014
Stats Chippac Ltd.
YiSu Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with warpage preventing mechani...
Patent number
8,703,535
Issue date
Apr 22, 2014
Stats Chippac Ltd.
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTION MECHANI...
Publication number
20130334714
Publication date
Dec 19, 2013
YiSu Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ASSIST AND METHOD OF...
Publication number
20130328220
Publication date
Dec 12, 2013
KyungHoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE PREVENTING MECHANI...
Publication number
20130328179
Publication date
Dec 12, 2013
MinJung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Controlling Warpage in Semicondu...
Publication number
20130300004
Publication date
Nov 14, 2013
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Depositing Underfill Material Wi...
Publication number
20130299995
Publication date
Nov 14, 2013
STATS ChipPAC, Ltd.
KyungHoon Lee
H01 - BASIC ELECTRIC ELEMENTS