Yisung Hwang

Follow

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses for bonding semiconductor chips
- Patent number 10,629,461
- Issue date Apr 21, 2020
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for bonding semiconductor chips
- Patent number 10,083,846
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for bonding semiconductor chips
- Patent number 9,704,732
- Issue date Jul 11, 2017
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus
- Patent number 9,698,117
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Yongdae Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding device
- Patent number 9,455,165
- Issue date Sep 27, 2016
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20180358247
- Publication date Dec 13, 2018
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20170287748
- Publication date Oct 5, 2017
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Device
- Publication number 20150303081
- Publication date Oct 22, 2015
- Samsung Electronics Co., Ltd.
- Yisung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20150228612
- Publication date Aug 13, 2015
- Samsung Electronics Co., Ltd.
- Yongdae HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EJECTOR AND DIE SEPARATION METHOD
- Publication number 20140238618
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20130160952
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS