Yit Meng Lee

Person

Selangor, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Cavity formed in a molding compound of a semiconductor package to r...
- Patent number 11,984,408
- Issue date May 14, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead reduction for improved creepage distance
- Patent number 10,734,327
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill dispensing system for integrated circuits
- Patent number 7,989,965
- Issue date Aug 2, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vittal Raja Manikam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250006596
- Publication date Jan 2, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20240413065
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...
- Publication number 20230124619
- Publication date Apr 20, 2023
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Type of bumpless and wireless semiconductor device
- Publication number 20230097173
- Publication date Mar 30, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...
- Publication number 20230068886
- Publication date Mar 2, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE
- Publication number 20200203289
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS
- Publication number 20100279471
- Publication date Nov 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Vittal Raja MANIKAM
- H01 - BASIC ELECTRIC ELEMENTS

Yit Meng Lee

Person

Patents Grantslast 30 patents

Cavity formed in a molding compound of a semiconductor package to r...

Lead reduction for improved creepage distance

Underfill dispensing system for integrated circuits

Patents Applicationslast 30 patents

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...

Type of bumpless and wireless semiconductor device

PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...

LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE

POLYMER CORE WIRE

UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS