Yit Meng Lee

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Selangor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Cavity formed in a molding compound of a semiconductor package to r...
- Patent number 11,984,408
- Issue date May 14, 2024
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead reduction for improved creepage distance
- Patent number 10,734,327
- Issue date Aug 4, 2020
- NXP USA, INC.
- Mariano Layson Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill dispensing system for integrated circuits
- Patent number 7,989,965
- Issue date Aug 2, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Vittal Raja Manikam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO R...
- Publication number 20230124619
- Publication date Apr 20, 2023
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Type of bumpless and wireless semiconductor device
- Publication number 20230097173
- Publication date Mar 30, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...
- Publication number 20230068886
- Publication date Mar 2, 2023
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE
- Publication number 20200203289
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Mariano Layson CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER CORE WIRE
- Publication number 20120073859
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS
- Publication number 20100279471
- Publication date Nov 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Vittal Raja MANIKAM
- H01 - BASIC ELECTRIC ELEMENTS