Yiu Fai KWAN

Person

Tsuen Wai, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Routable electroforming substrate comprising removable carrier
- Patent number 10,475,666
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Tat Chi Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated lead frame including doped silver layer
- Patent number 9,847,468
- Issue date Dec 19, 2017
- ASM Technology Singapore Pte. Ltd.
- Yu Lung Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe treatment for enhancing adhesion of encapsulant thereto
- Patent number 8,012,886
- Issue date Sep 6, 2011
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Pre-plated leadframe having enhanced encapsulation adhesion
- Patent number 7,691,679
- Issue date Apr 6, 2010
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with enhanced encapsulation adhesion
- Patent number 7,125,750
- Issue date Oct 24, 2006
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROUTABLE ELECTROFORMING SUBSTRATE COMPRISING REMOVABLE CARRIER
- Publication number 20180308710
- Publication date Oct 25, 2018
- ASM Technology Singapore Pte Ltd
- Tat Chi CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED LEAD FRAME INCLUDING DOPED SILVER LAYER
- Publication number 20170365759
- Publication date Dec 21, 2017
- ASM Technology Singapore Pte Ltd
- Yu Lung LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME
- Publication number 20160204003
- Publication date Jul 14, 2016
- Yiu Fai KWAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRE-PLATED LEAD FRAME FOR COPPER WIRE BONDING
- Publication number 20130098659
- Publication date Apr 25, 2013
- Yiu Fai KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED LEADFRAME HAVING ENHANCED ENCAPSULATION ADHESION
- Publication number 20080233683
- Publication date Sep 25, 2008
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME TREATMENT FOR ENHANCING ADHESION OF ENCAPSULANT THERETO
- Publication number 20080216921
- Publication date Sep 11, 2008
- Yiu Fai KWAN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Leadframe with enhanced encapsulation adhesion
- Publication number 20060110855
- Publication date May 25, 2006
- ASM Assembly Materials Ltd.
- Yiu Fai Kwan
- H01 - BASIC ELECTRIC ELEMENTS

Yiu Fai KWAN

Person

Patents Grantslast 30 patents

Routable electroforming substrate comprising removable carrier

Plated lead frame including doped silver layer

Leadframe treatment for enhancing adhesion of encapsulant thereto

Pre-plated leadframe having enhanced encapsulation adhesion

Leadframe with enhanced encapsulation adhesion

Patents Applicationslast 30 patents

ROUTABLE ELECTROFORMING SUBSTRATE COMPRISING REMOVABLE CARRIER

PLATED LEAD FRAME INCLUDING DOPED SILVER LAYER

METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME

PRE-PLATED LEAD FRAME FOR COPPER WIRE BONDING

PRE-PLATED LEADFRAME HAVING ENHANCED ENCAPSULATION ADHESION

LEADFRAME TREATMENT FOR ENHANCING ADHESION OF ENCAPSULANT THERETO

Leadframe with enhanced encapsulation adhesion