Yiu-Hsiang Chang

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Taoyuan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Copper metallization for through-glass vias on thin glass
- Patent number 12,200,875
- Issue date Jan 14, 2025
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING APPARATUS
- Publication number 20250236985
- Publication date Jul 24, 2025
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESION PROMOTING LAYER, METHOD FOR DEPOSITING CONDUCTIVE LAYER ON...
- Publication number 20220177364
- Publication date Jun 9, 2022
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER METALLIZATION FOR THROUGH-GLASS VIAS ON THIN GLASS
- Publication number 20210360797
- Publication date Nov 18, 2021
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...