Yiu Ming CHEUNG

Person

Kowloon, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Detaching a die from an adhesive tape by air ejection
- Patent number 11,764,098
- Issue date Sep 19, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ngai Tat Man
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gang bonding process for assembling a matrix of light-emitting elem...
- Patent number 10,186,549
- Issue date Jan 22, 2019
- ASM Technology Singapore Pte. Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-enhanced provision of underfill to electronic devices usi...
- Patent number 9,583,366
- Issue date Feb 28, 2017
- ASM Technology Singapore Pte. Ltd.
- Qinglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression bonding of semiconductor chips
- Patent number 8,967,452
- Issue date Mar 3, 2015
- ASM Technology Singapore Pte. Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving mechanism for chip detachment apparatus
- Patent number 7,303,647
- Issue date Dec 4, 2007
- ASM Assembly Automation Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mini-type food chopper
- Patent number 7,258,292
- Issue date Aug 21, 2007
- Yiu Joe Cheung
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Apparatus for semiconductor chip detachment
- Patent number 7,240,422
- Issue date Jul 10, 2007
- ASM Assembly Automation LTD
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick and place assembly for transporting a film of material
- Patent number 7,182,118
- Issue date Feb 27, 2007
- ASM Assembly Automation LTD
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for loading electronic packages of varying sizes
- Patent number 6,711,873
- Issue date Mar 30, 2004
- ASM Assembly Automation Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for pick and place handling
- Patent number 6,655,045
- Issue date Dec 2, 2003
- ASM Assembly Automation Limited
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric sensor for measuring bonding parameters
- Patent number 6,279,810
- Issue date Aug 28, 2001
- ASM Assembly Automation LTD
- Lai Wa Chan-Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DETACHING A DIE FROM AN ADHESIVE TAPE BY AIR EJECTION
- Publication number 20220336254
- Publication date Oct 20, 2022
- ASM Technology Singapore Pte Ltd
- Ngai Tat MAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING WITH LIQUID PHASE SOLDER
- Publication number 20160336292
- Publication date Nov 17, 2016
- ASM Technology Singapore Pte Ltd
- Dewen TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES
- Publication number 20160276177
- Publication date Sep 22, 2016
- ASM Technology Singapore Pte Ltd
- Qinglong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
- Publication number 20130270230
- Publication date Oct 17, 2013
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mini-type food chopper
- Publication number 20060231655
- Publication date Oct 19, 2006
- Yiu Joe Cheung
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Apparatus and method for semicondutor chip detachment
- Publication number 20050255673
- Publication date Nov 17, 2005
- ASM Assembly Automation Ltd
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for indexing and severing film
- Publication number 20050034577
- Publication date Feb 17, 2005
- ASM Assembly Automation Ltd
- Yuk Cheung Au
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for thin die detachment
- Publication number 20040115904
- Publication date Jun 17, 2004
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for off-loading electronic packages
- Publication number 20030084642
- Publication date May 8, 2003
- ASM Assembly Automation Ltd
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for pick and place handling
- Publication number 20020133971
- Publication date Sep 26, 2002
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS

Yiu Ming CHEUNG

Person

Patents Grantslast 30 patents

Detaching a die from an adhesive tape by air ejection

Gang bonding process for assembling a matrix of light-emitting elem...

Die bonding with liquid phase solder

Thermally-enhanced provision of underfill to electronic devices usi...

Thermal compression bonding of semiconductor chips

Driving mechanism for chip detachment apparatus

Mini-type food chopper

Apparatus for semiconductor chip detachment

Pick and place assembly for transporting a film of material

Apparatus for loading electronic packages of varying sizes

Apparatus and method for pick and place handling

Piezoelectric sensor for measuring bonding parameters

Patents Applicationslast 30 patents

DETACHING A DIE FROM AN ADHESIVE TAPE BY AIR EJECTION

DIE BONDING WITH LIQUID PHASE SOLDER

THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES

THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS

Mini-type food chopper

Apparatus and method for semicondutor chip detachment

Apparatus and method for indexing and severing film

Apparatus and method for thin die detachment

Apparatus and method for off-loading electronic packages

Apparatus and method for pick and place handling