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Hong Kong, CN
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Patents Grants
last 30 patents
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Patent Grant
Microfluidic platform and method for controlling the same
Patent number
10,384,209
Issue date
Aug 20, 2019
The Chinese University of Hong Kong
Qiu Lan Chen
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Leadframe comprising tin plating or an intermetallic layer formed t...
Patent number
7,462,926
Issue date
Dec 9, 2008
ASM Assembly Automation Ltd.
Ran Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coating for enhancing adhesion of molding compound to semiconductor...
Patent number
7,329,617
Issue date
Feb 12, 2008
ASM Assembly Automation LTD
Jianxiong Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROFLUIDIC PLATFORM AND METHOD FOR CONTROLLING THE SAME
Publication number
20150027555
Publication date
Jan 29, 2015
The Chinese University of Hong Kong
Qiu Lan Chen
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Application
MICRO-BLASTING TREATMENT FOR LEAD FRAMES
Publication number
20100155260
Publication date
Jun 24, 2010
Yiu Fai Kwan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe comprising tin plating or an intermetallic layer formed t...
Publication number
20070126096
Publication date
Jun 7, 2007
ASM Assembly Automation Ltd
Ran Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Coating for enhancing adhesion of molding compound to semiconductor...
Publication number
20060131720
Publication date
Jun 22, 2006
Jianxiong Li
H01 - BASIC ELECTRIC ELEMENTS