Yiwen Zhang

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Bedford, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for packaging semiconductors at a wafer level
- Patent number 8,653,673
- Issue date Feb 18, 2014
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20130154124
- Publication date Jun 20, 2013
- Raytheon Company
- Robert B. Hallock
- H01 - BASIC ELECTRIC ELEMENTS