Yixiong YANG

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhancing gapfill performance of dram word line
- Patent number 12,114,488
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Yong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated dipole region for transistor
- Patent number 12,112,951
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 12,104,243
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Annamalai Lakshmanan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Amorphous silicon-based scavenging and sealing EOT
- Patent number 12,100,595
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Yong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PMOS high-k metal gates
- Patent number 12,051,734
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,020,982
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 12,022,650
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
P-type dipole for P-FET
- Patent number 11,996,455
- Issue date May 28, 2024
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
V-NAND stacks with dipole regions
- Patent number 11,997,849
- Issue date May 28, 2024
- Applied Materials, Inc.
- Yong Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,961,734
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,955,332
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lids and lid assembly kits for atomic layer deposition chambers
- Patent number 11,932,939
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Muhammad M. Rasheed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming semiconductor structures
- Patent number 11,908,914
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an oxygen free platinum group metal film
- Patent number 11,894,233
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated dipole flow for transistor
- Patent number 11,888,045
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming molybdenum contacts
- Patent number 11,869,806
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reflector film growth
- Patent number 11,776,980
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Luping Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal process chamber lid with backside pumping
- Patent number 11,715,667
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Anqing Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type dipole for p-FET
- Patent number 11,658,218
- Issue date May 23, 2023
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of tuning film properties of metal nitride using plasma
- Patent number 11,646,226
- Issue date May 9, 2023
- Applied Materials, Inc.
- Wenyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 11,587,936
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PMOS high-K metal gates
- Patent number 11,552,177
- Issue date Jan 10, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen free deposition of platinum group metal films
- Patent number 11,488,830
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner for V-NAND word line stack
- Patent number 11,476,267
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Jacqueline S. Wrench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless gap fill
- Patent number 11,437,271
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Yixiong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,417,517
- Issue date Aug 16, 2022
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition chamber with funnel-shaped gas dispersion c...
- Patent number 11,384,432
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Muhammad M. Rasheed
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming impurity free metal alloy films
- Patent number 11,359,282
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal process chamber lid with backside pumping
- Patent number 11,335,591
- Issue date May 17, 2022
- Applied Materials, Inc.
- Anqing Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type dipole for p-FET
- Patent number 11,289,579
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Yongjing Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL
- Publication number 20240420947
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSI...
- Publication number 20240371613
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Muhannad Mustafa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN...
- Publication number 20240371654
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALIDE AND ORGANIC PRECURSORS FOR METAL DEPOSITION
- Publication number 20240360557
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES
- Publication number 20240363723
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...
- Publication number 20240355673
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Wei LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20240332008
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS
- Publication number 20240287678
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
V-NAND STACKS WITH DIPOLE REGIONS
- Publication number 20240268108
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Yong Yang
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES
- Publication number 20240266414
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO ENHANCE MATERIAL STRUCTURES
- Publication number 20240266163
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Srinivas GANDIKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED MOLYBDENUM DEPOSITION
- Publication number 20240218502
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- TUERXUN AILIHUMAER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DIPOLE FORMATION PROCESSES
- Publication number 20240222195
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Tianyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING METAL GATE RESISTANCE FOR NEXT GENERATION NMOS D...
- Publication number 20240204061
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BASED HYDROGEN BARRIER
- Publication number 20240194526
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PULSE DEPOSITION PROCESSES
- Publication number 20240183033
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Tianyi Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20240154018
- Publication date May 9, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED MOLYBDENUM DEPOSITION
- Publication number 20240102157
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- TUERXUN AILIHUMAER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RADICAL TREATMENT FOR METAL GATE STACK
- Publication number 20240087899
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Zhihui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL MOLYBDENUM DEPOSITION
- Publication number 20240060175
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20240063064
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL MOLYBDENUM DEPOSITION
- Publication number 20240026529
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES
- Publication number 20230402291
- Publication date Dec 14, 2023
- Applied Materials, Inc.
- Steven C. H. HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES
- Publication number 20230377901
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Steven C. H. HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION
- Publication number 20230377879
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT OXIDATION AND ETCH OF PVD MOLYBDENUM FOR BOTTOM UP GAP FILL
- Publication number 20230343645
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Meng-Shan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
- Publication number 20230343643
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING
- Publication number 20230335434
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Anqing Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CLEANING AND SELECTIVE MOLYBDENUM DEPOSITION PROCESSES
- Publication number 20230323543
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Tuerxun Ailihumaer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIELD SUPPRESSED METAL GAPFILL
- Publication number 20230326744
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS

Yixiong YANG

Person

Patents Grantslast 30 patents

Enhancing gapfill performance of dram word line

Integrated dipole region for transistor

Methods and apparatus for processing a substrate

Amorphous silicon-based scavenging and sealing EOT

PMOS high-k metal gates

Metal based hydrogen barrier

Low resistivity DRAM buried word line stack

P-type dipole for P-FET

V-NAND stacks with dipole regions

Treatments to enhance material structures

Treatments to enhance material structures

Lids and lid assembly kits for atomic layer deposition chambers

Methods of forming semiconductor structures

Electronic device having an oxygen free platinum group metal film

Integrated dipole flow for transistor

Methods of forming molybdenum contacts

Methods for reflector film growth

Thermal process chamber lid with backside pumping

P-type dipole for p-FET

Method of tuning film properties of metal nitride using plasma

Low resistivity DRAM buried word line stack

PMOS high-K metal gates

Oxygen free deposition of platinum group metal films

Liner for V-NAND word line stack

Seamless gap fill

Treatments to enhance material structures

Atomic layer deposition chamber with funnel-shaped gas dispersion c...

Methods for forming impurity free metal alloy films

Thermal process chamber lid with backside pumping

P-type dipole for p-FET

Patents Applicationslast 30 patents

METAL OXIDE PRECLEAN FOR BOTTOM-UP GAPFILL IN MEOL AND BEOL

HIGH-THROUGHPUT PLASMA LID FOR SEMICONDUCTOR MANUFACTURING PROCESSI...

SILICON NITRIDE DAMAGE-FREE DRY ETCH METHOD FOR TUNGSTEN REMOVAL IN...

HALIDE AND ORGANIC PRECURSORS FOR METAL DEPOSITION

MULTI-THRESHOLD VOLTAGE INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

HYBRID MOLYBDENUM FILL SCHEME FOR LOW RESISTIVITY SEMICONDUCTOR APP...

INTEGRATED DIPOLE REGION FOR TRANSISTOR

METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS

V-NAND STACKS WITH DIPOLE REGIONS

MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

TREATMENTS TO ENHANCE MATERIAL STRUCTURES

PLASMA-ENHANCED MOLYBDENUM DEPOSITION

DIPOLE FORMATION PROCESSES

METHOD OF REDUCING METAL GATE RESISTANCE FOR NEXT GENERATION NMOS D...

METAL BASED HYDROGEN BARRIER

MULTI-PULSE DEPOSITION PROCESSES

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

PLASMA-ENHANCED MOLYBDENUM DEPOSITION

RADICAL TREATMENT FOR METAL GATE STACK

CONFORMAL MOLYBDENUM DEPOSITION

INTEGRATED DIPOLE REGION FOR TRANSISTOR

CONFORMAL MOLYBDENUM DEPOSITION

METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES

METHODS FOR PATTERNING SUBSTRATES TO ADJUST VOLTAGE PROPERTIES

BARRIER LAYER FOR PREVENTING ALUMINUM DIFFUSION

GRADIENT OXIDATION AND ETCH OF PVD MOLYBDENUM FOR BOTTOM UP GAP FILL

GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...

THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING

INTEGRATED CLEANING AND SELECTIVE MOLYBDENUM DEPOSITION PROCESSES

FIELD SUPPRESSED METAL GAPFILL