Yo-Se EUM

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for sawing a semiconductor package
- Patent number 11,018,038
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Yong Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball mounter
- Patent number 10,016,833
- Issue date Jul 10, 2018
- Samsung Electronics Co., Ltd.
- Seok-Yong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming external terminals of a package and apparatus for...
- Patent number 9,113,585
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- Yo-Se Eum
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Equipment and method for cutting package
- Patent number 8,132,305
- Issue date Mar 13, 2012
- Samsung Electronics Co., Ltd.
- Tai-Kew Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR SAWING A SEMICONDUCTOR PACKAGE
- Publication number 20200111691
- Publication date Apr 9, 2020
- Samsung Electronics Co., Ltd.
- YONG KI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL MOUNTER
- Publication number 20150001278
- Publication date Jan 1, 2015
- Samsung Techwin Co., Ltd.
- SEOK-YONG LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING EXTERNAL TERMINALS OF A PACKAGE AND APPARATUS FOR...
- Publication number 20140220774
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Yo-Se EUM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE
- Publication number 20120225150
- Publication date Sep 6, 2012
- Dong-Chul HAN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EQUIPMENT AND METHOD TO CLASSIFY SEMICONDUCTOR PACKAGES
- Publication number 20120194214
- Publication date Aug 2, 2012
- Samsung Electronics Co., Ltd.
- Yo-se EUM
- G01 - MEASURING TESTING
Information Patent Application
EQUIPMENT AND METHOD FOR CUTTING PACKAGE
- Publication number 20080056832
- Publication date Mar 6, 2008
- Samsung Electronics Co., Ltd.
- Tai-Kew CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR