Yohei UCHIDA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire clamp apparatus calibration method and wire bonding apparatus
- Patent number 11,004,822
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE CLAMP DEVICE CALIBRATION METHOD AND WIRE BONDING DEVICE
- Publication number 20190279957
- Publication date Sep 12, 2019
- SHINKAWA LTD.
- Yohei UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS