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Yohei WAKUDA

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF PLATING AND APPARATUS FOR PLATING
    • Publication number 20250075364
    • Publication date Mar 6, 2025
    • EBARA CORPORATION
    • Yasuyuki MASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20240301582
    • Publication date Sep 12, 2024
    • EBARA CORPORATION
    • Yohei WAKUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD
    • Publication number 20210154629
    • Publication date May 27, 2021
    • EBARA CORPORATION
    • Yasuyuki MASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD
    • Publication number 20180282895
    • Publication date Oct 4, 2018
    • EBARA CORPORATION
    • Yohei WAKUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD
    • Publication number 20180221835
    • Publication date Aug 9, 2018
    • EBARA CORPORATION
    • Yasuyuki MASUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING METHOD
    • Publication number 20170278813
    • Publication date Sep 28, 2017
    • EBARA CORPORATION
    • Yohei WAKUDA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR