Yoichi Hiruta

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reel tape for provisionally supporting a bare chip
- Patent number 6,182,828
- Issue date Feb 6, 2001
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- G01 - MEASURING TESTING
Information Patent Grant
Flip-chip connection type semiconductor integrated circuit device
- Patent number 6,111,317
- Issue date Aug 29, 2000
- Kabushiki Kaisha Toshiba
- Takashi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board for evaluating the characteristics of a semiconductor chip an...
- Patent number 6,094,057
- Issue date Jul 25, 2000
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having ball grid array
- Patent number 5,998,861
- Issue date Dec 7, 1999
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare chip prober device
- Patent number 5,952,841
- Issue date Sep 14, 1999
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- G01 - MEASURING TESTING
Information Patent Grant
Flip chip mounting type semiconductor device
- Patent number 5,801,447
- Issue date Sep 1, 1998
- Kabushiki Kaisha Toshiba
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electrode portion in semiconductor device
- Patent number 5,648,686
- Issue date Jul 15, 1997
- Kabushiki Kaisha Toshiba
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor devices having two encapsulants
- Patent number 5,629,566
- Issue date May 13, 1997
- Kabushiki Kaisha Toshiba
- Kazuhide Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,533,664
- Issue date Jul 9, 1996
- Kabushiki Kaisha Toshiba
- Mamoru Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power source noise suppressing type semiconductor device
- Patent number 5,477,079
- Issue date Dec 19, 1995
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having sealing means
- Patent number 5,463,245
- Issue date Oct 31, 1995
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a chip with an external bump terminal equa...
- Patent number 5,461,197
- Issue date Oct 24, 1995
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for mounting semiconductor wafer
- Patent number 5,424,917
- Issue date Jun 13, 1995
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device of multichip module-type
- Patent number 5,401,688
- Issue date Mar 28, 1995
- Kabushiki Kaisha Toshiba
- Yasuhiro Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 5,179,434
- Issue date Jan 12, 1993
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package type semiconductor device
- Patent number 5,138,433
- Issue date Aug 11, 1992
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing MOS transistor by dual species implantation...
- Patent number 4,764,478
- Issue date Aug 16, 1988
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing MOS semiconductor device with planarized conductive l...
- Patent number 4,713,356
- Issue date Dec 15, 1987
- Kabushiki Kaisha Toshiba
- Yoichi Hiruta
- H01 - BASIC ELECTRIC ELEMENTS

Yoichi Hiruta

Person

Patents Grantslast 30 patents

Reel tape for provisionally supporting a bare chip

Flip-chip connection type semiconductor integrated circuit device

Board for evaluating the characteristics of a semiconductor chip an...

Semiconductor device having ball grid array

Bare chip prober device

Flip chip mounting type semiconductor device

Connecting electrode portion in semiconductor device

Flip-chip semiconductor devices having two encapsulants

Method of manufacturing a semiconductor device

Power source noise suppressing type semiconductor device

Semiconductor integrated circuit device having sealing means

Electronic device having a chip with an external bump terminal equa...

Semiconductor device and method for mounting semiconductor wafer

Semiconductor device of multichip module-type

Semiconductor device and manufacturing method thereof

Multi-chip package type semiconductor device

Method of manufacturing MOS transistor by dual species implantation...

Manufacturing MOS semiconductor device with planarized conductive l...