Yoichi Makino

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component mounting apparatus and component mounting method
- Patent number 10,766,073
- Issue date Sep 8, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoichi Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method
- Patent number 10,668,584
- Issue date Jun 2, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoichi Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounted body manufacturing system and component mounted b...
- Patent number 10,661,401
- Issue date May 26, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiji Mizuoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate conveyance mechanism and component mounting method
- Patent number 10,165,716
- Issue date Dec 25, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshihiko Nagaya
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate conveyance mechanism and component mounting device
- Patent number 9,615,494
- Issue date Apr 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshihiko Nagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus
- Patent number 8,001,678
- Issue date Aug 23, 2011
- Panasonic Corporation
- Akira Kabeshita
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for reversing a chip vertically
- Patent number 7,669,317
- Issue date Mar 2, 2010
- Panasonic Corporation
- Yoichi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing semiconductor chip
- Patent number 7,637,714
- Issue date Dec 29, 2009
- Panasonic Corporation
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method
- Patent number 7,437,818
- Issue date Oct 21, 2008
- Matsushita Electric Industrial Co., Ltd.
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component suction device, component mounting apparatus and componen...
- Patent number 7,017,261
- Issue date Mar 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenji Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT MOUNTED BODY MANUFACTURING SYSTEM AND COMPONENT MOUNTED B...
- Publication number 20180243869
- Publication date Aug 30, 2018
- SEIJI MIZUOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTER AND COMPONENT MOUNTING METHOD
- Publication number 20180093328
- Publication date Apr 5, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- YOICHI MAKINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTER AND COMPONENT MOUNTING METHOD
- Publication number 20180093357
- Publication date Apr 5, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- YOICHI MAKINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONVEYANCE MECHANISM AND COMPONENT MOUNTING DEVICE
- Publication number 20160021800
- Publication date Jan 21, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Toshihiko NAGAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONVEYANCE MECHANISM AND COMPONENT MOUNTING METHOD
- Publication number 20160021801
- Publication date Jan 21, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- Toshihiko NAGAYA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COMPONENT MOUNTING APPARATUS
- Publication number 20090007420
- Publication date Jan 8, 2009
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component mounting apparatus and component mounting method
- Publication number 20070101572
- Publication date May 10, 2007
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING...
- Publication number 20070039686
- Publication date Feb 22, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoichi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for removing semiconductor chip
- Publication number 20060285965
- Publication date Dec 21, 2006
- Akira Kabeshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component suction device, component mounting apparatus and componen...
- Publication number 20020178578
- Publication date Dec 5, 2002
- Kenji Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Yoichi Makino

Person

Patents Grantslast 30 patents

Component mounting apparatus and component mounting method

Component mounting method

Component mounted body manufacturing system and component mounted b...

Substrate conveyance mechanism and component mounting method

Substrate conveyance mechanism and component mounting device

Component mounting apparatus

Method for reversing a chip vertically

Apparatus and method for removing semiconductor chip

Component mounting method

Component suction device, component mounting apparatus and componen...

Patents Applicationslast 30 patents

COMPONENT MOUNTED BODY MANUFACTURING SYSTEM AND COMPONENT MOUNTED B...

COMPONENT MOUNTER AND COMPONENT MOUNTING METHOD

COMPONENT MOUNTER AND COMPONENT MOUNTING METHOD

SUBSTRATE CONVEYANCE MECHANISM AND COMPONENT MOUNTING DEVICE

SUBSTRATE CONVEYANCE MECHANISM AND COMPONENT MOUNTING METHOD

COMPONENT MOUNTING APPARATUS

Component mounting apparatus and component mounting method

CHIP REVERSING DEVICE AND CHIP REVERSING METHOD, AND CHIP MOUNTING...

Apparatus and method for removing semiconductor chip

Component suction device, component mounting apparatus and componen...